Electronic device

ABSTRACT

An electronic device includes a housing sidewall defining an opening and a display component, such as a display cover, disposed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is defined by the sidewall and the display cover with the cavity in fluid communication with an external environment through the gap. In at least one example, an epoxy component at least partially defines the cavity and can be in direct contact with the housing sidewall.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This claims priority to U.S. Provisional Patent Application No.63/374,738, filed 6 Sep. 2022, and entitled “ELECTRONIC DEVICE,” to U.S.Provisional Patent Application No. 63/364,012, filed 2 May 2022, andentitled “ELECTRONIC DEVICE,” and to U.S. Provisional Patent ApplicationNo. 63/266,829, filed 14 Jan. 2022, and entitled “ELECTRONIC DEVICE,”the disclosures of which are hereby incorporated by reference in theirentireties.

FIELD

The present disclosure relates generally to electronic devices. Moreparticularly, the present disclosure relates to wearable electronicdevices.

BACKGROUND

Electronic devices are increasingly being designed with deviceportability in mind, for example, to allow users to use these devices ina wide variety of situations and environments. In the context ofwearable devices, these devices can be designed to include manydifferent functionalities and to be operated in many different locationsand environments. The components of an electronic device, for example,the processors, memory, antennas, display, and other components canpartially determine a level of performance of the electronic device.Further, the arrangement of these components with respect to one anotherin the device can also determine the level of overall performance of theelectronic device.

Continued advances in electronic devices and their components haveenabled considerable increases in performance. Existing components andstructures for electronic devices can, however, limit the levels ofperformance of such devices. For example, while some components canachieve high levels of performance in some situations, the inclusion ofmultiple components in devices sized to enhance portability can limitthe performance of the components, and thus, the performance of thedevice. Consequently, further tailoring and arrangement of componentsfor electronic devices to provide additional or enhanced functionality,without introducing or increasing undesirable device properties, can bedesirable.

SUMMARY

In at least one example of the present disclosure, a housing sidewallcan define an opening and a display component, such as a display cover,can be disposed in the opening to form a gap between the housingsidewall and the display component. In at least one example, the cavityis defined by the sidewall and the display cover, with the cavity influid communication with an external environment through the gap. In atleast one example, an epoxy component at least partially defines thecavity and can be in direct contact with the housing sidewall.

In at least one example of an electronic device, a housing sidewallincludes an upper sidewall portion and a lower sidewall portion bondedto a middle sidewall portion disposed between the upper and lowersidewall portions. The housing can define an opening and the displayassembly can be disposed in the opening to form the gap between thehousing and the display assembly. Also, in at least one example, anepoxy component can serve as a seal disposed between the displayassembly and the sidewall, the epoxy extending laterally across the gapwith the epoxy component seal bonded directly to the middle portion ofthe sidewall.

In at least one embodiment, an electronic device can include a sidewalldefining an internal volume and an opening. The sidewall can include anupper portion, a lower portion, and a middle portion disposed betweenand bonded to the upper portion and the lower portion. The device canalso include a display cover disposed in the opening and defining theinternal volume, a side cavity defined by the display assembly and thesidewall, the cavity in fluid communication with an external environmentthrough a gap formed between the display assembly and the sidewall, andan epoxy layer contacting the lower portion and the middle portion andat least partially defining the cavity.

In at least one example embodiment, an electronic device can include anouter housing defining an internal volume, a first speaker and a secondspeaker disposed in the internal volume. The first speaker can include aframe disposed around a periphery of a diaphragm of the first speaker. Afront volume can be defined by the outer housing, the first speaker, andthe second speaker. Similarly, a first back volume can be defined by thefirst speaker and the frame, and a second back volume can be defined bythe second speaker and the frame.

In at least one embodiment, an electronic device can include an outerhousing, an inner housing spaced apart from the outer housing, and aspeaker assembly disposed between the inner and outer housings. Thespeaker assembly can include a first speaker, a second speaker, and aspeaker frame supporting the first speaker. The device can furtherinclude a first back volume defined by the inner housing and the firstspeaker, and a second back volume defined by the inner housing and thesecond speaker, the second back volume separated from the first backvolume by the speaker frame.

In at least one example, an electronic device can include an outerhousing, an inner housing, and a speaker assembly disposed between theinner housing and the outer housing. The speaker assembly can include afirst speaker and a second speaker. The electronic device can furtherinclude a front volume defined by the outer housing and the speakerassembly, a back volume defined by the inner housing and the speakerassembly, a first vent through which a first end of the front volume isin fluid communication with an external environment, and a second ventthrough which a second end of the front volume is in fluid communicationwith the external environment. The back volume can be separated intofirst and second isolated portions.

In at least one embodiment, an electronic device can include a housingdefining an internal volume and an aperture, a button disposed in theaperture, the button including a plunger extending into the internalvolume, and a speaker frame disposed in the internal volume and definingan opening. The plunger can extend through the opening.

In at least one embodiment, an electronic device can include a housingdefining an internal volume, a plunger extending into the internalvolume, and a frame structurally supporting a first speaker and a secondspeaker. The frame can be disposed in the internal volume and define anopening between the first and second speakers. The plunger can bealigned with the opening.

In at least one embodiment, an electronic device can include an outerhousing defining an aperture, an inner housing spaced apart from theouter housing and defining an internal volume, the inner housing and theouter housing defining a speaker volume, a button having a plunger, thebutton disposed in the aperture, and a speaker assembly including aspeaker frame defining a hole. The plunger can be aligned with the holeand can extend into the speaker volume toward the inner housing.

In at least one embodiment, an electronic device can include a sidewallincluding an antenna and defining an internal volume, a printed circuitboard (PCB) disposed in the internal volume, an insulating materialdisposed in the internal volume, and an electrical connector contactingthe PCB, the electrical connector extending through the insulatingmaterial and forming an electrical contact between the antenna and thePCB.

In at least one exemplary embodiment, an electronic device can include aconductive housing sidewall defining an internal volume, a printedcircuit board (PCB) disposed in the internal volume, an electricalconnector contacting the PCB and extending through an insulatingmaterial, and an elongate conductive member disposed between the housingsidewall and the electrical connector, the elongate conductive membercontacting the electrical connector and the housing sidewall.

In at least one embodiment, an electronic device includes a housingsidewall including a lower portion and an electrically conductive upperportion separated from the lower portion by a non-conductive material,the housing sidewall defining an internal volume and an opening, adisplay component disposed in the opening, a printed circuit board (PCB)disposed in internal volume below the display component, an insulatingmaterial disposed in the internal volume between the housing sidewalland the PCB, and a connector forming an electrical pathway between theupper conductive portion of the sidewall and the PCB. The upper portioncan form a ring surrounding a periphery of the display component.

In at least one embodiment, a wearable electronic device can include ahousing having a sidewall. The sidewall can define an internal volume,the sidewall extending 360-degrees circumferentially around the internalvolume. The sidewall can also define a first aperture, a second aperturebetween about 155 and 205 degrees relative to the first aperture, and athird aperture closer to the second aperture than the first aperture.The wearable electronic device can further include a first microphonedisposed in the internal volume and configured to receive sound throughthe first aperture, a second microphone disposed in the internal volumeand configured to receive sound through the second aperture, and a thirdmicrophone disposed in the internal volume and configured to receivesound through the third aperture.

In at least one embodiment, a wearable electronic device can include ahousing sidewall defining an internal volume, a first band receivingfeature, a second band receiving feature opposite the first bandreceiving feature, a first sidewall portion extending between the firstband receiving feature and the second band receiving feature, the firstsidewall portion defining a first aperture closer to the first bandreceiving feature than the second band receiving feature, a secondsidewall portion disposed opposite the first sidewall portion andextending between the first band receiving feature and the second bandreceiving feature, the second sidewall portion defining a secondaperture and a third aperture, the second aperture defined closer to thesecond band receiving feature than the first band receiving feature. Thewearable electronic device can further include a first microphonedisposed in the internal volume adjacent the first aperture, a secondmicrophone disposed in the internal volume adjacent the second aperture,and a third microphone disposed in the internal volume adjacent thethird aperture.

In at least one example of the present disclosure, an electronic devicecan include a sidewall defining an internal volume, a first aperture, asecond aperture, a third aperture, and a fourth aperture, a firstmicrophone disposed in the internal volume adjacent the first aperture,a second microphone disposed in the internal volume adjacent the secondaperture, a third microphone disposed in the internal volume adjacentthe third aperture, and a speaker disposed in the internal volumeadjacent the fourth aperture. A distance along the sidewall between thefirst and second apertures can be larger than a distance along thesidewall between the second and third apertures and the fourth aperturecan be adjacent the first aperture.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1A shows an example of a wearable electronic device;

FIG. 1B shows a top view of a portion of the wearable electronic device;

FIG. 1C shows a bottom view of a portion of the wearable electronicdevice;

FIG. 2A shows a perspective view of an example of a wearable electronicdevice;

FIG. 2B shows a perspective view of an example of a wearable electronicdevice;

FIG. 2C shows an exploded view of an example of a wearable electronicdevice;

FIG. 3 shows an exploded view of an example of a wearable electronicdevice;

FIG. 4 shows a portion of a sidewall of an example of a wearableelectronic device;

FIG. 5A shows a cross-sectional view of a sidewall of an example of awearable electronic device;

FIG. 5B shows another cross-sectional view of a sidewall of an exampleof a wearable electronic device;

FIG. 5C shows another cross-sectional view of a sidewall of an exampleof a wearable electronic device;

FIG. 6 shows a cross sectional view of an interface between a plasticand metal portion of a sidewall of an example of an electronic device;

FIG. 7A shows another view of the interface of FIG. 6 ;

FIG. 7B shows another view of the interface of FIG. 6 ;

FIG. 7C shows another view of the interface of FIG. 6 ;

FIG. 8 shows a method of bonding a metal substrate to a non-metalsubstrate;

FIG. 9A shows a cross-sectional view of a sidewall and internalcomponents of an example of a wearable electronic device;

FIG. 9B shows another cross-sectional view of a sidewall and internalcomponents of an example of a wearable electronic device;

FIG. 9C shows another cross-sectional view of a sidewall and internalcomponents of an example of a wearable electronic device;

FIG. 10A shows a top perspective view of a housing sidewall of anexample of an electronic device;

FIG. 10B shows a top view of the housing sidewall of FIG. 10A;

FIG. 10C shows a close up top view of a portion of the housing sidewallof FIG. 10A;

FIG. 11 shows a cross-sectional view of a sidewall and internalcomponents of an example of a wearable electronic device;

FIG. 12 shows a top view of a portion of an example of an electronicdevice including a printed circuit board (PCB) and surroundingelectrical contacts;

FIG. 13 shows a top view of a portion of an example of an electronicdevice including a printed circuit board (PCB) and surroundingelectrical contacts;

FIG. 14A shows a cross-sectional view of a sidewall and internalcomponents of an example of a wearable electronic device;

FIG. 14B shows a cross-sectional view of a sidewall and internalcomponents of an example of a wearable electronic device;

FIG. 15A shows a side view of an example of a wearable electronicdevice;

FIG. 15B shows a cross sectional view thereof;

FIG. 15C shows a circuit diagram equivalent of the device shown in FIGS.15A and 15B worn by a user;

FIG. 16 shows a PCB of an example of an electronic device;

FIG. 17 shows a portion of a PCB of an example of an electronic device;

FIG. 18 shows a portion of a PCB of an example of an electronic device;

FIG. 19 shows a temperature sensor disposed on an ALS module of anexample of an electronic device;

FIG. 20A shows a cross sectional view of a portion of an example of anelectronic device;

FIG. 20B shows a close up view of the portion of FIG. 20A;

FIG. 20C shows an example of a speaker frame;

FIG. 20D shows an example of a speaker assembly of an electronic device;

FIG. 20E shows the speaker assembly of FIG. 20D with an example of abutton;

FIG. 20F shows another cross sectional view of the speaker assembly ofFIG. 20E;

FIG. 20G shows another cross sectional view of the speaker and buttonassembly of FIG. 20E;

FIG. 20H shows another cross sectional view of the speaker and buttonassembly of FIG. 20E;

FIG. 20I shows another cross sectional view of the speaker and buttonassembly of FIG. 20F;

FIG. 20J shows another cross sectional view of the speaker and buttonassembly of FIG. 20F;

FIG. 20K shows another cross sectional view of the speaker and buttonassembly of FIG. 20F;

FIG. 21 shows another cross sectional view of the speaker assembly ofFIG. 20E;

FIG. 22 shows a user riding a bike while wearing an example of awearable electronic device;

FIG. 23 shows an example of an electronic device subjected to wind;

FIG. 24 shows an example of an electronic device subjected to wind fromvarious directions;

FIG. 25 shows a top view of an example of an electronic device;

FIG. 26 shows a top view of an example of an electronic device;

FIG. 27 shows a top view of an example of an electronic device; and

FIG. 28 shows a top view of an example of an electronic device.

FIG. 29A shows a bottom view of an example of an electronic device;

FIG. 29B shows a cross sectional view of a rear cover of an example ofan electronic device;

FIG. 30 shows a partial cross-sectional view of a rear cover and afastener of an example of an electronic device;

FIG. 31 shows a partial cross-sectional view of a rear cover and afastener of an example of an electronic device;

FIG. 32 shows an example of a rear cover fastener;

FIG. 33A shows another example of a rear cover fastener;

FIG. 33B shows another example of a rear cover fastener;

FIG. 34 shows a top view of another example of a fastener;

FIG. 35 shows a top view of another example of a fastener;

FIG. 36A shows a top view of another example of a fastener;

FIG. 36B shows a side view thereof;

FIG. 37 shows a method of forming the fastener shown in FIG. 36A andFIG. 36B;

DETAILED DESCRIPTION

Reference will now be made in detail to representative examplesillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred example or embodiment. To the contrary, it is intended tocover alternatives, modifications, and equivalents as can be includedwithin the spirit and scope of the described embodiments as defined bythe appended claims.

The following disclosure generally relates to electronic devices. Moreparticularly, the present disclosure relates to wearable electronicdevices. The wearable electronic devices of the present disclosureinclude tailored arrangements of components to provide additional orenhanced functionality, without introducing or increasing undesirabledevice properties or performance. In this way, more functionality andcomponentry can be included in wearable devices for user's to wear andoperate in any condition or activity without limiting the functionalityand durability of the devices.

Specific examples and embodiments of electronic devices, includingwearable electronic devices, are discussed below with reference to FIGS.1-28 . However, those skilled in the art will readily appreciate thatthe detailed description given herein with respect to these Figures isfor explanatory purposes only and should not be construed as limiting.Furthermore, as used herein, a system, a method, an article, acomponent, a feature, or a sub-feature comprising at least one of afirst option, a second option, or a third option should be understood asreferring to a system, a method, an article, a component, a feature, ora sub-feature that can include one of each listed option (e.g., only oneof the first option, only one of the second option, or only one of thethird option), multiple of a single listed option (e.g., two or more ofthe first option), two options simultaneously (e.g., one of the firstoption and one of the second option), or combination thereof (e.g., twoof the first option and one of the second option).

FIG. 1A shows an example of an electronic device 100. The electronicdevice shown in FIG. 1A is a watch, such as a smartwatch. The smartwatchof FIG. 1A is merely one representative example of a device that can beused in conjunction with the systems and methods disclosed herein.Electronic device 100 can correspond to any form of wearable electronicdevice, a portable media player, a media storage device, a portabledigital assistant (“PDA”), a tablet computer, a computer, a mobilecommunication device, a GPS unit, a remote control device, or otherelectronic device. The electronic device 100 can be referred to as anelectronic device, or a consumer device. In some examples, theelectronic device 100 can include a housing 102 that can carryoperational components, for example, in an internal volume at leastpartially defined by the housing. The electronic device 100 can alsoinclude a strap 104, or other retaining component that can secured thedevice 100 to a body of a user as desired. Further details of theelectronic device are provided below with reference to FIG. 1B.

FIG. 1B illustrates the electronic device 100, for example a smartwatch,that can be substantially similar to and can include some or all of thefeatures of the devices described herein, including the electronicdevice 100 shown in FIG. 1A but without the strap 104. The device 100can include a housing 102, and a display assembly 106 attached to thehousing 102. The housing 102 can substantially define at least a portionof an exterior surface of the device 100.

The display assembly 106 can include a glass, a plastic, or any othersubstantially transparent exterior layer, material, component, orassembly. The display assembly 106 can include multiple layers, witheach layer providing a unique function, as described herein.Accordingly, the display assembly 106 can be, or can be a part of, aninterface component. The display assembly 106 can define a frontexterior surface of the device 100 and, as described herein, thisexterior surface can be considered an interface surface. In someexamples, the interface surface defined by display assembly 106 canreceive inputs, such as touch inputs, from a user.

In some examples, the housing 102 can be a substantially continuous orunitary component and can define one or more openings to receivecomponents of the electronic device 100. In some examples, the device100 can include input components such as one or more buttons 108 and/ora crown 110 that can be disposed in the openings. In some examples, amaterial can be disposed between the buttons 108 and/or crown 110 andthe housing 102 to provide an airtight and/or watertight seal at thelocations of the openings. The housing 102 can also define one or moreopenings or apertures, such as aperture 112 that can allow for sound topass into or out of the internal volume defined by the housing 102. Forexample, the aperture 112 can be in communication with a microphonecomponent disposed in the internal volume. In some examples, the housing102 can define or include a feature, such as an indentation to removablycouple the housing 102 and a strap or retaining component.

FIG. 1C shows a bottom perspective view of the electronic device 100.The device 100 can include a back cover 114 that can be attached to thehousing 102, for example, opposite the display assembly 106. The backcover 114 can include ceramic, plastic, metal, or combinations thereof.In some examples, the back cover 114 can include an at least partiallyelectromagnetically transparent component 116. The electromagneticallytransparent component 116 can be transparent to any desired wavelengthsof electromagnetic radiation, such as visible light, infrared light,radio waves, or combinations thereof. In some examples, theelectromagnetically transparent component 116 can allow sensors and/oremitters disposed in the housing 102 to communicate with the externalenvironment. Together, the housing 102, display assembly 106 and backcover 114 can substantially define an internal volume and an externalsurface of the device 100.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 1A-1C can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.1A-1C.

As noted above, portable and wearable electronic devices can be designedto be used in many different environments and during any kind ofactivity throughout a user's day. For example, wearable electronicwatches, headphones, and phones can be carried by a user duringexercise, sleep, driving, biking, hiking, swimming, diving, outside inthe rain, outside in the sun, and so forth. Wearable electronic devicesdescribed herein are configured to withstand the varied and often harshconditions of various environments, including changing environments andwet environments. Wet environments can include wearing devices in therain or when submerged during bathing or swimming, for example.

Examples of electronic devices disclosed herein include components,features, arrangements, and configurations that resists damage andcorrosion due to exposure to moisture. Some aspects of devices describedherein can include gaps between components through which moisture,water, or other fluids could enter. The gaps may be present foraesthetic purposes or for functional purposes. However, one or morecomponents, including epoxy seals, insulating materials and frames, andother components of devices described herein can be configured toprevent such moisture from entering into the internal volume of thedevice where sensitive electronic component could be damaged thereby.

Along these lines, FIGS. 2A and 2B show right and left perspectiveviews, respectively, of an example of a wearable electronic device 200including a housing 202 including sidewalls 228 defining an opening inwhich the display cover 222 is disposed. The sidewalls can include anupper portion 232 defining an upper peripheral edge surrounding thedisplay cover 222, a lower portion 234, and a middle portion 236disposed between the upper portion 232 and the lower portion 234. Thewearable electronic device 200 can also include a securement strap 203configured to secure the wearable electronic device 200 to an appendageof the user. In at least one example, the sidewalls 228 of the housing202 can define an upper peripheral edge of the device 200 surroundingthe display cover 222.

In at least one example, the display cover 222 defines a top surfacedisposed in a plane. The plane can be flush with or set below the upperperipheral edge of the sidewalls 228. In this way, when the wearableelectronic device 200 comes into contact with a surface or object at ornear the upper surface of the display cover 222 and/or the upperperipheral edge of the sidewalls 228, contact and potential damage tothe display cover 222 can be reduced. In one example, the display cover222 is set flush with or below the upper peripheral edges of thesidewalls 228 to protect the display cover 222 from damage.

In at least one example, as shown in FIG. 2A, the sidewalls 228 candefine a first side of the wearable electronic device 200 having arecessed feature in which a crown 210 is positioned. The crown 210 canbe a part of a turn dial button or other functional knob configured tobe manipulated by the user. The crown 210 can be disposed in therecessed portion, as noted above, such that first side of the sidewalls228 extend outward and at least partially around the crown 210. In thisway, contacts and bumps against of other objects against the first sideof the sidewall 228 during use can contact the sidewall 228 withoutpressing or turning the crown 210. In this way, the recessed portion ofthe first side of the sidewalls 228 prevents inadvertent manipulation ofthe crown 210. The button 209 shown in FIG. 2A can also be at leastpartially surrounded by an outwardly extending portion of the sidewall228, such that the button 209 is disposed within a recess thereof, toprotect the button 209 form inadvertent contacts.

In at least one example, as shown in FIG. 2B, the sidewalls 228 candefine a second side opposite the first side shown in FIG. 2A. In suchan example, the wearable electronic device 200 can include a firstspeaker vent 249, a second speaker vent 247, and a button 208 disposedbetween the first speaker vent 249 and the second speaker vent 247. Thefirst and second speaker vents 249, 247 can provide fluid communicationfrom a common speaker volume behind the sidewall 228 (e.g., within aninternal volume defined by the sidewalls 228) and the externalenvironment. The button 208 can be disposed between the first and secondspeaker vents 249, 247 to save space and provide a compact designwithout interrupting the functionality of the one or more speakerscommunicating with the external environment through the first and secondspeaker vents 247, 249.

FIG. 2C illustrates an exploded view of another example of an electronicdevice 200, which can also be a portion of a wearable electronic watchor other wearable electronic device. Device 200 includes a displayassembly 206, housing 202, back cover 214, and electromagneticallytransparent component 216. In addition, the exploded view of FIG. 2Aillustrates various internal components that may be disposed within aninternal volume defined by the housing 202, back cover 214,electromagnetically transparent component 216, and display assembly 206.For example, the device 200 can include one or more printed circuitboards (PCBs) 218 and one or more antenna components 220, electricalconnectors and flexes, buttons, seals, gaskets, memory components,processors, sensors, dials, batteries, and so forth.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 2A-2C can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.2A-2C.

FIG. 3 illustrates a close-up view of a portion of the exploded view ofthe device 200 shown in FIG. 2 , including the housing 202 and thedisplay assembly 206, with the display assembly further exploded toillustrate the display cover 222 and display layers 224. In addition,the exploded view of FIG. 3 shows a wave ring 226 (also referred toherein as an “elongate conductive member”), which will be described anddiscussed in more detail hereafter with reference to other figures. Inat least one example, the housing 202 includes sidewall or sidewalls 228that define an internal volume and an opening 230. When assembled, thedisplay assembly 206 or one or more components of the display assembly206 can be disposed in the opening to form an outer surface of thedevice 200 and define the internal volume.

In at least one example, the sidewall 228 can include an upper portion232 and a lower portion 234. The upper portion 232 and the lower portion234 can be separated by a middle portion 236 disposed between the upperportion 232 and the lower portion 234. In at least one example, theupper portion 232 and the lower portion 234 of the sidewall 228 caninclude one or more electrically conductive materials and the middleportion 236 can include one or more electrically non-conductivematerials and/or an insulating material. The middle portion 236 can bemolded to or otherwise adhered to the upper portion 232 and/or the lowerportion 234 such that the upper portion 232, the lower portion 234, andthe middle portion 236 form a single, unitary sidewall 228 of thehousing 202, as shown.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 3 can be included,either alone or in any combination, in any of the other examples ofdevices, features, components, and parts shown in the other figures.Likewise, any of the features, components, and/or parts, including thearrangements and configurations thereof shown in the other figures canbe included, either alone or in any combination, in the example of thedevices, features, components, and parts shown in FIG. 3 .

FIG. 4 illustrates an example of a middle portion 336 separated from therest of a sidewall of a housing, similar to the middle portion 236 shownas part of the sidewall 228 of FIG. 3 . In the example shown in FIG. 4 ,a non-conductive material component or ring 338 is bonded to the middleportion 336. In at least one example, the non-conductive material ring338 can include an epoxy component 338. The term “epoxy,” as usedherein, can include non-conductive adhesives as generally used andunderstood in the art, including hot-melt adhesives. The middle portion336 can also include a ridge feature 340 extending at least partiallyaround an internal surface of the middle portion 336. The ridge feature340 can form a lower surface of the middle portion 336. In addition, atleast one example, the middle portion 336 can include one or more upperprotrusions 342 spaced about and extending inward relative to anexternal surface of the sidewall 328. In addition, at least one exampleof the middle portion 336 can include one or more lower protrusions 344spaced about and extending from the middle portion 336, as shown in FIG.4 . FIGS. 5A, 5B, and 5C illustrate partial cross-sectional views, asindicated in FIG. 3 , but around various points along the sidewall 228in order to illustrate the positions and configurations of the middleportion 336, epoxy component 338, upper portion 332, and lower portion334.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 4 can be included,either alone or in any combination, in any of the other examples ofdevices, features, components, and parts shown in the other figures.Likewise, any of the features, components, and/or parts, including thearrangements and configurations thereof shown in the other figures canbe included, either alone or in any combination, in the example of thedevices, features, components, and parts shown in FIG. 4 .

In the first cross-sectional view of FIG. 5A, the ridge feature 340 andlower protrusion 344 of the middle portion 336 can be seen. In at leastone example, the epoxy component 338 is bonded to an upper surface 348defined by the lower portion 334 of the sidewall 328. The epoxycomponent 338 can also be bonded directly to the middle portion 336, forexample including the lower protrusion 344 and a lower surface 346 ofthe middle portion 336 defined by the ridge feature 340. FIG. 5Billustrates another cross-sectional view at a point along the sidewall328 where an upper protrusion 342 and a lower protrusion 344 of themiddle portion 336 can be seen and FIG. 5C illustrates anothercross-sectional view at a point along the sidewall 328 where an upperprotrusion 342 of the middle portion 336 can be seen.

As shown in FIGS. 5A, 5B, and 5C, any possible path for moisture totravel from an external environment 350 to the internal volume 352through the sidewall 328 of the device is blocked by the epoxy component338 bonded directly to either the lower portion 334 of the sidewall 328or the middle portion 336. Thus, the tight bond of the epoxy component338 against one or more portions 334, 336 prevents water and moisturefrom entering into the internal volume 352 from the external environment350 through the sidewall 328. In addition to the moisture-tight bondbetween the epoxy component 338 and the sidewall 328, in at least oneexample, the middle portion 336 of the sidewall 328 can be bonded to theupper and lower portions 332, 334, respectively, such that the bondtherebetween substantially or completely prevents moisture from passingthrough or into the sidewall 328 at the interface between the middleportion 336 and the upper and lower portions 332, 334, respectively.FIGS. 6-8 illustrate the interface and methods of bonding the middleportion 336 to the lower portion 334 and/or the upper portion 332 of thesidewall 328.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 5A-5C can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.5A-5C.

On example of a plastic-metal interface, such as an interface between aconductive bottom portion 434 and a non-conductive middle portion 436,is shown in FIG. 6 . In at least one example, the bottom portion 434 caninclude titanium and the middle portion 436 can include a polymermaterial. In one example, polymer material can include polybutyleneterephthalate (PBT) including glass filled PBT. As shown, the titaniummaterial of bottom portion 434 can be treated to form enhancedpolymer-Ti bonding at the interface.

In at least one example, surface features including nano-pores andprotrusions 454 can be present and the polymer can flow into and aroundthe pores and protrusions during formation to increase the bondingtherebetween. In at least one example, an etching treatment can becarried out to form the features 454 shown in FIG. 6 . In at least oneexample, the etching treatment can include etching with sulfuric acid toform roughened macro-pockets or features in the titanium substrate ofthe bottom portion 434. Also, an oxide layer can be formed using asodium hydroxide oxidation step resulting in the nano-pores andprotrusions 454 shown in FIG. 6 .

Along these lines, FIGS. 7A-7C show images of the bottom portion 434 atvarious stages of the process described above, including a 1,000×SEMimage of an acid etched surface in FIG. 7A. FIG. 7B shows a 50,000×SEMimage of an oxide surface with uniform oxide formation exhibitingplate-like morphology. FIG. 7C shows a layered double hydroxideinterface including protrusions 454, similar to those illustrated inFIG. 6 , into and around which the plastic polymer material of themiddle portion 436 can flow and interlock with the metal material of thebottom portion 434 for enhanced bonding, as described above.

FIG. 8 shows a flowchart of an example of a method 460 of forming theinterface shown in FIGS. 6-7C. In at least one example, a step 456includes the sulfuric acid etching step noted above and another step 458includes the sodium hydroxide oxidation step noted above. In at leastone example of the method 460, between steps 456 and 458, a de-smuttingmethod 462 can be carried out to de-smut the surface. In at least oneexample of the de-smutting method 462 shown in FIG. 8 , a step 464 caninclude an alkaline de-smut, for example using sodium hydroxide (NaOH)and another step 466 can include an acid de-smutting step, for exampleusing nitric acid (HNO3).

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 6-8 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.6-8 .

FIGS. 9A-9C illustrate a cross-sectional view of a device 500 similar toFIGS. 5A-5C but with a display assembly 506 disposed in the opening 532formed by the sidewall 528. In at least one example, the displayassembly 506, which includes the display cover 522 and one or more otherdisplay layers 524 disposed below the display cover 522, can be disposedin the opening 532 such that a gap 568 is formed between the displayassembly 506 and the sidewall 528. The gap 568 can be understood as aspace between the display assembly 506, or the display cover 522thereof, and the sidewall 528, or upper portion 532 thereof, wherein thedisplay cover 522 does not contact the sidewall 528. In at least oneexample, an upper surface of the display cover 522 can be flush with, ordisposed lower than, an upper surface of the upper portion 532.

In at least one example, a cavity 570 is formed in which the wave ring526 is disposed. The cavity can be defined by the sidewall 528,including the upper portion 532 and the middle portion 536, the epoxycomponent 538, and the display assembly 506 or at least the displaycover 522 thereof. In at least one example, the cavity can also bedefined by an insulating material 576 disposed between the displayassembly 506 and/or display cover 522 thereof and the epoxy component538. One or more other components, including an lth (or last) antennalayer 578 or other layers. As noted above, the epoxy component 538 canbond to other layers and components, including the lth antenna layer578, middle portion 536, lower portion 534, and/or the insulatingmaterial 576 to prevent moisture from entering the internal volume 552from an external environment 550 of the device 500, such that anymoisture or fluids entering the cavity 570 through the gap 568 do notcontinue on into the internal volume 552. In this way, the cavity can befluid-tight.

FIGS. 9A, 9B, and 9C show cross-sectional views at various locationsaround the sidewall 528 to illustrate how the wave ring 526 disposed inthe cavity 570 can contact the upper portion 532 of the sidewall 528 atone or more locations along a length of the wave ring 526, as shown inFIG. 9B, and contact an electrical contact 572 on the other side of thecavity 570 at one or more other locations along the length of the wavering 526, as shown in FIG. 9C.

Accordingly, in at least one example of the present disclosure, thehousing sidewall 528 can define an opening 532 and a display component,such as the display cover 522, can be disposed in the opening 532 toform the gap 568 between the housing sidewall 528 and the displaycomponent. In at least one example, the cavity 570 is defined by thesidewall 528 and the display cover 522 with the cavity 570 in fluidcommunication with the external environment 550 through the gap 568. Inat least one example, the epoxy component 538 at least partially definesthe cavity 570 and can be in direct contact with the housing sidewall528.

In at least one example of the electronic device 500, the housingsidewall 528 has an upper sidewall portion 532 and a lower sidewallportion 534 bonded to a middle sidewall portion 536 disposed between theupper and lower sidewall portions 532, 534, respectively. The housingcan define the opening 532 and the display assembly 506 can be disposedin the opening 532 to form the gap 568 between the housing and thedisplay assembly 506. Also, in at least one example, the epoxy component538 can serve as a seal disposed underneath the display assembly 506 andextend laterally across the gap 568 with the epoxy component seal 538bonded directly to the middle portion 536 of the sidewall 528.

In at least one example of the present disclosure, the electronic device500 can include the sidewall 528 defining the internal volume 552 andthe opening 532. In at least one example, the sidewall 528 can includean upper portion 532, a lower portion 534, and a middle portion 536disposed between and bonded to the upper portion 532 and the lowerportion 534. The device 500 can also include the display cover 522disposed in the opening 532 and defining the internal volume 552, theside cavity 570 defined by the display assembly 506 and the sidewall528, with the cavity 570 in fluid communication with an externalenvironment 550 through the gap 568 formed between the display assembly506 and the sidewall 528, and an epoxy layer 538 contacting the lowerportion 534 and the middle portion 536, and at least partially definingthe cavity 570.

As noted above and as shown in FIGS. 9A-9C, the device 500 can includethe epoxy component 538 at least partially disposed between the displaycover 522 of the display assembly 506 and the lower portion 534, orbetween one or more other components of the display assembly 506,including the display layers 524, and the lower portion 534. One or moreother components can also be disposed or stacked between the epoxycomponent 538 and the display assembly 506 or cover 522, for example thelth antenna layer 578. In addition, as shown in FIG. 9C, one or moreexamples of the device 500 can include can include an insulatingmaterial 576. The insulating polymer 576 can include and support aprinted circuit board (PCB) 574 disposed in the internal volume 552.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 9A-9C can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.9A-9C.

As noted above, FIGS. 9A, 9B, and 9C show cross-sectional views atvarious locations around the sidewall 528 to illustrate how the wavering 526 disposed in the cavity 570 can contact the upper portion 532 ofthe sidewall 528 at one or more locations along a length of the wavering 526, as shown in FIG. 9B. Accordingly, in at least one example, themiddle portion 536 can include gaps or windows through which columns orother portions of the upper portion 532 of the sidewall 528 are exposedthrough the middle portion 536 such that the wave ring 526 can contactthe upper portion 532 directly, as shown in FIG. 9B. Also, the wave ring526 can contact an electrical contact 572 on the other side of thecavity 570 at one or more other locations along the length of the wavering 526, as shown in FIG. 9C. The electrical contact 572 can extendthrough the insulating material 576 and electrically connect to the PCB574. In this way, the upper portion 532 of the sidewall 528 can beelectrically connected to the PCB 574 through the wave ring 526. Whilethe contact between the wave ring 526 and the electrical contact 572 isshown in FIGS. 9A-9C (as well as in FIGS. 12 and 13 below) as resultingfrom an undulation or circumferential variation (or wave) in the wavering 526, the electrical contacts can be made by any number of discreteor continuous geometries such as indents or protrusions on the wave ring526, or by discrete or continuous protrusions on the housing. Accordingto this example, any number of mating geometries can be used between thewave ring 526 and the housing.

In at least one example, the upper portion 532 of the sidewall 528 canbe electrically isolated from the lower portion 534 via the intermediaryand non-conductive middle portion 536. In this way, the upper portion532 can be a resonating element of an antenna of the device 500 with thelower portion 534 of the sidewall 528 acting as an electrical groundingplane relative to the resonating plane of the upper portion 532. Asnoted above, the upper portion 532 can be electrically connected to thePCB 574 of the device 500 such that signals received and sent by theresonating upper portion 532 can be directed to the PCB 574 and can beprocessed with one or more processors or other electronic components ofthe device 500, including any processors or other electronic componentsmounted on the PCB.

The wearable electronic devices described herein can include antennasconfigured to send and receive electromagnetic signals during use.Incorporating effective antennas into small, compact devices such aswearable electronic watches can be challenging because the greater thedistance between a resonating plane and a grounding plane of an antenna,among other factors, the better the performance of the antenna will be.However, space is often limited to create the required Z-distancesnecessary in compact wearable electronic devices. In devices describedherein, the housing and sidewalls of the device can be electricallyseparated into multiple portions to create resonating elements andgrounding elements of an antenna with sufficient separation (Z-distance)therebetween for the housing itself to act as an antenna. However, thisdesign has its own challenges, including electrically connecting theresonating element to a PCB, processor, or other electronic devicewithout reducing the Z-distance of the antenna. Wearable electronicdevices described herein are configured to overcome these challenges.

Along these lines, FIGS. 10A and 10B show a top perspective view and atop view, respectively, of a subassembly of a device 600, according tothe present disclosure. The subassembly includes housing sidewall 628that includes the upper portion 632, lower portion 634, and middleportion 636 separating the upper portion 632 from the lower portion 634.As noted above, the upper portion 632 and the lower portion 632 caninclude electrically conductive material and the middle portion 636 caninclude electrically insulating or non-conductive material such that theupper portion 632 of the sidewall 628 forms a resonating element of anantenna separated by a distance in the vertical or “Z” direction (or a“Z-distance”) relative to the electrical grounding plane of the lowerportion 634.

The epoxy component 638 can also be bonded to an inside of the sidewall628 and to the middle portion 636 and the lower portion 634. Inaddition, the wave ring 626 is also shown in FIG. 10A. A close-up viewof the subassembly from a top view is shown in FIG. 10C, with theclose-up region indicated in FIG. 10B, to illustrate a portion of thewave ring 626 extending away from the sidewall 628 to make contact withan electrical contact in the internal volume of the device. As shown inFIG. 10B, the interior portion of the wave ring 626 includes a number ofdimples or protrusions 640 configured to engage electrical contacts 572that can extend through the insulating material 576 and electricallyconnect to the PCB 574 (as shown in FIG. 9C). As noted above, inaddition or alternative to the protrusions 640 on the wave ring 626,protrusions can be formed on the housing to facilitate or ensure asecure connection between the wave ring 626 and the electrical contacts572.

FIG. 10A also illustrates a cutout 650 formed in the inner surface ofthe housing sidewall 628. As shown, the cutout 650 extends into thehousing sidewall 628 below the middle portion 636 and the epoxy portion638. According to one example, the cutout 650 is formed by machining orotherwise removing a slot of the housing sidewall 628 to create a cavityon the upper portion of the interior volume, prior to assembly of thedevice 600. As shown, the cutout 650 provides for additional volumewithin the housing sidewall 628 that can be used for connections orother housings. According to one example, the cutout provides anisolated volume where component connections can be made, such as formicrophones or pressure sensors that are typically located near theexterior of the device 600, without consuming valuable interior volume.In one example, board to board connections, such as hot-bar soldering,can be performed on the main PCB within the main cavity, and a flexiblecable can then extend from the main PCT to the cutout 650 formed in theinner surface of the housing sidewall 628. Within the cutout 650,according to one example, a tray 652 that can be fastened to the housingcan include a circuit board 654 with any number of components 656, suchas connectors, components, gyroscopes, accelerometers, etc. that canthen be connected to the PCB via the flexible cable. According to thisexample, the transition of a number of connections to previously unusedportions of the housing sidewall 628 allows for added room within thehousing for additional battery volume or the inclusion of additionalconnectors or features on the main PCB.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 10A-10C can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.10A-10C.

FIG. 11 shows another cross-sectional view similar to thecross-sectional views shown in FIGS. 9A-9C, where a sidewall 728includes an upper portion 732, a middle portion 736, and a lower portion734. The sidewall 728 defines an opening 732 in which a display assembly706 is disposed, the display assembly 706 including a display cover 722and one or more other display layers or components 724. An epoxycomponent 738 can contact the lower portion 734 and the middle portion736 as shown and one or more other layers or components can be stackedor disposed between the display cover 722 and the epoxy component 738,for example the lth antenna layer 772 and the insulating material 776.In at least one example, the insulating material 776, which can also bereferred to herein as a mounting component 776, can structurally supportone or more other components, including the electrical contact 772extending there through and/or the display cover 722 or other components724 of the display assembly 706.

In at least one example, the display mounting component 776 may beformed from a molded material, such as a molded insulating material,including a polymer (e.g., a low-injection-pressure-overmolded polymer).The material that forms component 776 may be epoxy, polyurethane, and/orother polymer materials. Thermoplastic and/or thermoset polymer may beused in forming component 776. Heat and/or light (e.g., ultravioletlight) may be used in curing the polymer forming component 776. As oneillustrative example, component 776 may be formed from a thermosetstructural adhesive such as a one-part heat-cured epoxy. Otherpolymer(s) may be used, if desired. Vacuum may be applied to theinterior of a mold to help draw liquid polymer into a desired shapewithin a mold during formation of component 776.

One or more surfaces of component 776 can serve as a reference surface(datum) that helps establish a desired physical relationship betweencomponent 776 and other portions of a device including the displayassembly 706. As an example, component 776 can be attached to anopposing surface of a housing using a layer of adhesive. The shape andlocation of component 776 relative to display cover layer 722, displaylayers 724, and other structures in display 706 can help establish adesired position for display 706 relative to a device housing. The uppersurface of component 776 can be molded directly to the underside ofdisplay cover 722 to help form an environmental seal. In some examples,however, the display assembly 706 can include a separate seal that canaid in forming an environmental seal between the display assembly 706and a housing.

The location of the display mounting component is indicated in FIGS. 11and 12 . As can be see, the display mounting component 776 extendsaround a periphery of the PCB 774. As the PCB 774 is smaller than thedisplay cover 722, the molded insulating material of the displaymounting component 776 may be adjacent to an edge of the PCB 774.

In some examples, however, a display assembly 706 for an electronicdevice can include a PCB 774 that has one or more major dimensions, suchas a width and/or height, which are substantially similar to thecorresponding major dimension of the display cover 722 or othercomponents 724 of the display assembly 706. By using a PCB 774 withthese dimensional relationships, a tail of the display layer 724 can bemade flush with a major surface of the PCB 774 so that only a singleshut-off is needed during the molding operation which can be used toform the display mounting component. Accordingly, the molded insulatingmaterial of the display mounting component 776 can be disposed on amajor surface of the PCB 774 and adjacent to a periphery thereon whilealso at least partially surrounding the flexible tail of an associateddisplay layers 724.

In the present example, the molded material of the display mountingcomponent 776 can also serve to affix the display assembly 706 to thedevice housing sidewall 728, or at least to a component of the sidewall728 such as the lower portion 734, and/or to provide an environmentalseal between the display cover 722 and the device housing sidewall 728.In some examples, the display mounting component 776 can at leastpartially define an exterior surface of the device, such as at an uppersurface of the upper portion 732. Thus, in some examples, a portion ofthe insulating molded material of the display mounting component 776that defines the exterior surface of the device can be positionedbetween the display cover 722 and a sidewall 728 of the housing.Further, in some examples, the portion of the exterior surface definedby the display mounting component 776 can be substantially level, inline with, and/or flush with portion of the exterior surface defined bythe housing sidewall 728 and/or display cover 722.

As noted above, in order to electrically connect the upper portion 732of the sidewall 728, as a resonating element of an antenna, theelectrical connector 772 can extend through the insulating material 776from the wave ring 726 to the PCB 774 and the wave ring 726 can contactthe upper portion 732 of the sidewall 728 at another point or locationalong the length of the wave ring 726, similar to that shown in FIG. 9Band described above. In this way, while the PCB 774 is disposed lowerthan the upper portion 732 of the sidewall 728, the upper portion 732 ofthe sidewall 728 can predominantly define an upper resonating planeseparated from the grounding plane defined by the lower portion 734 ofthe sidewall 728. This increased Z-distance between the upper and lowerportions 732, 734 of the sidewall 728 correspondingly increases theperformance of the antenna of which the upper portion 732 forms a part,or at least forms a part of a resonating element thereof.

As illustrated in FIG. 11 , the wavering 726 can vary in profile.According to one example, the wavering 726 is asymmetric in shape,placing the protrusion or dimple lower on the body so that it provides abetter contact with the extension feature 784 of the electricalconnector 772. In other words, due to the asymmetric profile of the wavering 726, the dimple or protrusion sits lower in the channel formed bythe sidewall 728, and can make a more secure connection to an extensionfeature 784 having a lower profile. Additionally, as shown in FIG. 11 ,the wave ring 726 can include any number of optional back dimples 727 toextend toward the wave ring 726 and towards the extension feature 784,ensuring a consistent contact therewith, as well as promoting contactwith the housing. Alternatively, or additionally, the sidewall 728 canhave selective protrusions or bump-outs 729 that reduce the distancebetween the wave ring 726 and the extension feature 784, ensuring asecure contact. Such added connection securement features can beespecially beneficial in corners of the sidewall 728 where antenna feedscan be located.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 11 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG. 11.

FIG. 12 shows a top view of a subassembly of a device according to thepresent disclosure, including a wave ring 826, insulating material 876,electrical contact 872, and PCB 874, which can be similar or part of anyof the devices, systems, or subassemblies described herein withreference to other figures. As shown in FIG. 12 , portions of the wavering 826 can be selectively overmolded 827 or otherwise insulated inareas where metal on metal contact with the housing is not desired, suchas where plastic to metal housing interlocks may occur. In theillustrated example of FIG. 12 , the electrical contact 872 forms asingular unitary piece extending around the PCB 874 with discreteconnection points 882 extending onto and contacting the PCB 882 orelectrical circuits/pathways or other components of or on the PCB 882.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 12 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG. 12.

FIG. 13 shows another example of top view of a subassembly similar tothat shown in FIG. 12 but with multiple discrete and separate electricalconnectors 972 a, 972 b, and 972 c making contact with the PCB 974. Anyof the features, components, and/or parts, including the arrangementsand configurations thereof shown in FIG. 13 can be included, eitheralone or in any combination, in any of the other examples of devices,features, components, and parts shown in the other figures. Likewise,any of the features, components, and/or parts, including thearrangements and configurations thereof shown in the other figures canbe included, either alone or in any combination, in the example of thedevices, features, components, and parts shown in FIG. 13 .

In at least one example, an electronic device can include a sidewall 728including an antenna 732, the sidewall defining an internal volume. Thedevice can also include a PCB 774 disposed in the internal volume, aninsulating material 776 disposed in the internal volume, and anelectrical connector 772 contacting the PCB 774, the electricalconnector 772 extending through the insulating material 776 and formingan electrical contact between the antenna 732 and the PCB 774.

In one example, the device can include a conductive housing sidewall 728defining an internal volume, a PCB 774 disposed in the internal volume,an electrical connector 772 contacting the PCB 774 and extending throughthe insulating material 776, and an elongate conductive member 726 (alsoreferred to herein as the wave ring 726) disposed between the housingsidewall 728 and the electrical connector 772, the elongate conductivemember 726 contacting the electrical connector 772 and the housingsidewall 728.

In one example, an electronic device can include a housing sidewall 728including a lower portion 734 and an electrically conductive upperportion 732 separated from the lower portion 734 by a non-conductivematerial 736, the housing sidewall 728 defining an internal volume andan opening 732, a display component 722 disposed in the opening 732, aPCB 774 disposed in internal volume below the display component 722, aninsulating material 776 disposed in the internal volume between thehousing sidewall 728 and the PCB 774, and a connector 772 forming anelectrical pathway between the upper conductive portion 732 of thesidewall 728 and the PCB 774. In such an example, the upper portion 732can form a ring surrounding a periphery of the display component 722.

In at least one example, the insulating material 776 is molded to theelectrical connector 772. In one example, as shown in FIG. 12 , theinsulating material 776 can include a continuous member extending arounda periphery of the PCB 774. Similarly, in at least one example, theinsulating material 776 can form or include a closed ring disposedbetween the PCB 774 and the antenna 732 formed by the upper portion 732of the sidewall 728. In one example, the elongate conductive member 726contacts the electrical connector 772 at a first location along a lengthof the elongate conductive member 726 and contacts the housing sidewall728 at a second location along the length of the elongate conductivemember 726. In at least one example, the elongate conductive member 726contacts the electrical connector 772 at a third location along thelength of the elongate conductive member 726 and contacts the housingsidewall 728 at a fourth location along the length of the elongateconductive member 772.

In at least one example, the electrical connector 772 includes acontinuous member 886, shown in FIG. 12 , that has one or more discreteextensions features 784, as shown in FIG. 11 , extending from thecontinuous member 886 and through the insulating material 776. Theextension features 784 extend through the insulating material 776 tocontact the wave ring 726 (or “elongate conductive member”), as shown inFIG. 11 .

As noted above, and with reference now to FIG. 14A, an increasedZ-distance between the upper portion 1032 as a resonating element of anantenna relative to the electrical ground plane of the lower portion1034 of the sidewall 1028 can increase the performance of the antenna.In order to increase the Z-distance, the display cover 1022 of thedevice can include a lower beveled surface to make room for theelectrical connector 1072 to extend further upward when making contactwith the wave ring 1026, thus increasing the overall plane of theresonating element of the antenna above the grounding plane of the lowerportion 1034 of the housing.

For example, as shown in FIG. 14A, the display cover 1022 includes alower beveled surface 1084, which provides a space for the electricalconnector 1072 to make an electrical connection with the wave ring 1026,and thus the upper portion 1032 of the sidewall 1028 that contacts thewave ring 1026, further upward to increase the Z-distance. TheZ-distance between the resonating plane 1088 and the grounding plane1090 is illustrated in FIG. 14B. As shown in FIG. 14A, the electricalconnector 1072 extends upward toward the display cover 1022 and into thespace that would otherwise be occupied by the display cover 1022 if notfor the beveled surface 1084.

The wave ring 1026 can likewise be raised to the level of contact withthe electrical connector 1072 shown in FIG. 14A to raise the averageheight/level of the resonating plane relative to the grounding planeformed at least in part by the lower portion 1034 of the sidewall 1028.In this way, the Z-distance shown in FIG. 14B can be maximized toincrease the average height/level of the resonating plane relative tothe grounding plane for improved antenna performance.

In at least one example, the insulating material 1076, elsewherereferred to herein as the display mounting component, can extend intothe spaced adjacent to the beveled surface of the display cover 1022 tosupport the display cover and other components of the display assembly1006, including the various display layers 1024 shown. In addition, inat least one example, a mask layer that can include a PVD layer, inklayer, or other masking layer can be disposed on a lower flat surface1086 of the display cover 1022 adjacent the beveled surface 1085. Themask can provide an aesthetic feature that reduces unwanted lightscattering and reflections at the transition between the lower surfaceof the display cover 1022 and the beveled surface 1084. In at least oneexample, the mask can be between about 50 microns and 150 microns thick,for example about 100 microns thick.

Thus, in at least one example, an electronic device described herein caninclude a sidewall 1028 defining an opening, a display component such asthe display cover 1022 disposed in the opening. The display cover 1022can include a lower beveled edge forming a beveled surface facing theinternal volume of the device. In such an example, the insulatingmaterial 1076 can contact the beveled surface of the display cover 1022forming a beveled boundary 1078 as shown in FIG. 14A.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 14A and 14B canbe included, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.14A and 14B.

Referring briefly back to the exploded view of a device shown in FIG. 2, at least one example of the device 200 can include a back cover 214and an electromagnetically transparent component 216.

Because wearable electronic devices are in contact with the user's bodyduring use, it can be advantageous to use the device for detecting auser's body temperature, including surface and core temperature.However, the temperature of the device and the environment in which itis used can change from moment to moment during use such that detectingthe user's core temperature with a wearable device can be challenging.However, devices described herein can overcome this challenge byincorporating more than one temperature sensor in the device atdifferent locations and applying one or more algorithms that include thetemperature sensed by each sensor as an input to determine a coretemperature of the user.

FIG. 15A illustrates an example of a device, for example a wearableelectronic watch device 1700. In at least one example, the electronicdevice 1700 can include a housing 1702 defining front and rear openings,with a display component 1706 disposed at the front opening and a rearcover 1714 disposed at the rear opening. The device 1700 of FIG. 15A canalso include strap retention features 1779 defined by the housing 1702for securing a strap to the device 1700. When a strap is connected tothe device 1700 via the strap retention features 1779, the device 1700can be configured to be worn by a user, for example on the wrist of auser, with the strap securing the rear cover 1714 against the skin ofthe user.

In such an example, the device 1700 can be configured to detect a wristor skin temperature of the user and extrapolate or detect/measure theuser's core temperature. In order to do this, in at least one example,the device 1700 can include two or more temperature sensors on or withinthe device 1700. For example, a first temperature sensor 1777 can belocated at, near, or adjacent the rear cover 1714, as indicated by thelower dot shown in FIG. 15A, also referred to as the bottom or lowerside of the device 1700. The dot is not a representation of a sensoritself but indicates an approximate location of the first temperaturesensor 1777. In addition, the device 1700 can include a secondtemperature sensor 1775 located at, near, or adjacent the displaycomponent 1706 on an opposite side from the first temperature sensor,also referred to as a top side of the device 1700.

In at least one example, a processor (not shown in FIG. 15A but disposedinside the device 1700) can be electrically connected to the firsttemperature sensor 1777 and the second temperature sensor 1775 andconfigured to determine a core temperature of a user based on a firsttemperature detected by the first temperature sensor 1777 and a secondtemperature detected by the second temperature sensor 1775.

FIG. 15A shows a partial cross-sectional view of the device 1700 shownin FIG. 15A to illustrate various internal components thereof. As shown,the device 1700 can include a housing 1702 defining front and rearopenings and an internal volume, with a display component 1706 disposedat the front opening and a rear cover 1714 disposed at the rear opening.The internal components can include various processors, batteries,microphones, speakers, wires and electrical flexes, antennas, displaycomponents, and so forth. In addition, the internal components of thedevice 1700 can include a first PCB 1773 disposed near, adjacent, andabove the rear cover 1714. In at least one example, the first PCB 1773can be adhered to the rear cover 1714. The device 1700 can also includea second PCB 1774 disposed near, adjacent, and beneath the displaycomponent 1706.

As shown in the cross-sectional view of FIG. 15B, the first temperaturesensor 1777 can be disposed on the first PCB 1773 and the secondtemperature sensor 1775 can be disposed on the second PCB 1774. In atleast one example, one or more other electronic components, includingheat generating electronic components can be disposed between the firsttemperature sensor 1777 and the second temperature sensor 1775 or, ifnot between the temperature sensors, 1777, 1775, a part of a thermalpath defined from one temperature sensor to the other through one ormore internal component of the device 1700. For example, a battery 1767can be disposed within the internal volume of the device 1700 at leastpartially between the first temperature sensor 1777 and the secondtemperature sensor 1775.

While the first temperature sensor 1777 can be near the user's wrist todetermine the temperature at or near the user's wrist, the device 1700can include other internal components that may generate or absorb heatsuch that the system temperature of the device 1700 can affect theaccuracy of the measurement of the user's wrist with the firsttemperature sensor 1777. Accordingly, in at least some examples, thedevice 1700 can include the second temperature sensor 1775 that takesinto account the system temperature of the device 1700 and one or morealgorithms can be used to determine the user's core temperature usingmeasurement taken from both the first temperature sensor 1777 and thesecond temperature sensor 1775. In at least one example, the firsttemperature sensor 1777 and the second temperature sensor can be inelectrical communication with one another.

In at least one example, the device 1700 can include one or moreprocessors in electrical communication with the first temperature sensor1777 and the second temperature sensor 1775. The one or more processorscan determine the user's core temperature from measurement taken by boththe first and second temperature sensors 1777, 1775 with one or morealgorithms applied to the measurement to take into account the systemtemperature and any thermal path existing through the device 1700 andits internal components disposed therein, some of which may be disposedbetween the first and second temperature sensors 1777, 1775 or, if notbetween the temperature sensors, 1777, 1775, a part of a thermal pathdefined from one temperature sensor to the other through one or moreinternal component of the device 1700. In this way, determining theuser's core temperature can be based, at least in part, on the heatgenerated by the heat generating components or heat absorbing componentor any other components disposed in the internal volume of the device1700.

Along these lines, FIG. 15C illustrates a circuit diagram equivalent tothe device 1700 contacting a user 1771 with a contact interface shown at1769. The illustrated diagram identifies temperature sensors T₁ and T₂,which can equate to the first and second temperature sensors 1777, 1775shown in FIG. 15B, respectively. The heat transfer path from the user1771, through the device 1700, and out to an external environment can bemodeled as a series of resistances illustrated by resistors R_(phys),R_(contact), R_(BC), R₁₋₂, and R_(FC), as shown in FIG. 15C withR_(phys) equating to the resistance of the user, R_(contact) equating tothe resistance at the contact interface, R_(BC) equating to theresistance of the back cover or any other components of the device 1700between the first temperature sensor T₁ (1777 in FIG. 15B) measuringtemperature T₁ and the contact interface 1769, R₁₋₂ equating to anyresistance in the system of the device 1700 including the thermal pathbetween the first temperature sensor 1777 and the second temperaturesensor 1775, and R_(FC) equating to the resistance of the displaycomponent 1706 or any other components of the device 1700 between thesecond temperature sensor (1775 in FIG. 15B) measuring temperature T₂and the external surface or external environment of the device 1700.

Using the modeled circuit diagram of heat flow from the wrist throughthe device 1700 as shown in FIG. 15C, one or more algorithms can be usedto determine the core temperature of the user. For example, a firstalgorithm modeling the temperature T_(BC) at the rear cover 1714 of thedevice 1700 can include:

T _(BC) =T ₁ +a _(o)(T ₁ −T ₂)

where:

a _(o) =R _(BC) /R ₁₋₂

An algorithm modeling a corrected temperature can include:

T _(c) =T ₁ +c _(o)(T ₁ −T ₂)

where:

c _(o) =a _(o) +h _(o)

and where:

h _(o) =R _(o) /R ₁₋₂

Furthermore, the model can also include self-heating constants (i.e.,c₁, a₁, h₁).

In at least one example, more than two temperature sensors can bedisposed in the device 1700 with measurement taken and input into one ormore algorithms to determine the core temperature of the user when thedevice 1700 contacts the user. As noted above, in at least one example,one or more electrical and/or heat generating components can be disposedin internal volume of the device 1700 and at least partially between thevarious sensors or at least as part of a thermal path between thevarious sensors.

In at least one example, the first temperature sensor 1777 can bedisposed directly against or adhered directly to the rear cover 1714 oranother portion of the housing 1702 near or adjacent or in contact withthe user during use. Similarly, in at least one example, the secondtemperature sensor 1775 can be disposed directly against, or adhereddirectly to, the display component 1706 or other portion of the housing1702. In at least one example, regardless of where each temperaturesensor 1777, 1775 is disposed, a thermally conductive adhesive, such asa thermally conductive pressure-sensitive adhesive, can be used tosecure the temperature sensors 1777, 1775 to another component withinthe internal volume of the device 1700.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 15A-15C can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.15A-15C.

FIG. 16 illustrates a PCB 1773 with an example of a location of atemperature sensor 1777. The PCB 1773 can be disposed near the rearcover 1714 similar to the first PCB 1773 shown in FIG. 15B. FIG. 26illustrates a PCB 1774 similar to the second PCB shown in FIG. 15B thatcan be disposed in the internal volume of the device 1700 near thedisplay component 1706. In the illustrated example of FIG. 17 , twolocations of a temperature sensor 1775 are shown where the temperaturesensor 1775 can be disposed on the PCB 1774 to be at or near the displaycomponent 1706 of the device 1700. In one example shown, the temperaturesensor 1775 can be disposed on the ALS module 1765. FIG. 18 showsanother example of locations of the temperature sensor 1775 on anexample of a PCB 1774 with one example location of the temperaturesensor 1775 being on an ALS module 1765 of the PCB 1774.

In at least one example, the temperature sensors 1777, 1775 describedherein can be adhered or otherwise secured to a PCB or other component,including the housing 1702 of the device 1700 without any under-fillmaterial between the temperature sensor 1777, 1775 and the housing 1702or PCB 1774. In at least one example, the temperature sensors 1777, 1775can be mounted to a PCB 1774, housing 1702, or other portion of thedevice 1700 without any encapsulation over the temperature sensor 1777,1775. The absence of under-fill material and/or encapsulation over thetemperature sensor 1777, 1775 reduces the complexity and uncertainty ofthe thermal path between the sensors 1777, 1775 and/or between thesensors 1777, 1775 and the user's body or the external environment, thussimplifying the modeling and processing of the user's core temperature.

In at least one example, as shown in FIG. 19 , a temperature sensor 1777is disposed on the ALS module 1765. In at least one example, as notedabove, the temperature sensor 1777 can be adhered to the ALS module 1765using an SMT/solder or other adhesive or bonding medium without anyencapsulation material disposed over and/or encapsulating thetemperature sensor 1777. In such an example, in order to protect thetemperature sensor 1777 from physical damage, one or more shields 1767a, 1767 b, 1767 c, and 1767 d can be disposed around the temperaturesensor 1777 such that other components are likely to come into contactwith the shields 1767 a-d before coming into contact with thetemperature sensor 1777 during assembly or use. The shields 1767 a-d canvary in number, size, position, and configuration but generally aretaller than the temperature sensor 1777 such that the shields 1767 a-dphysically protect the temperature sensor 1777. In at least one example,the shields 1767 a-d include inexpensive, non-electrically functioningor connected components. In this way, the shields 1767 a-d can absorbcontact, be dented, chipped, or otherwise physically damaged duringassembly or use of the device 1700 without negatively affecting thefunctionality of the device 1700 and the temperature sensor 1777.

In many scenarios or environments where a user may want to wear thedevices disclosed herein, it may be advantageous to outputhigh-frequency, high decibel sounds to alert others of an emergencysituation such as a fall or injury to the user. These sounds or alertscan be referred to herein as siren alerts and/or sounds. In order toproduce high-frequency siren sounds alongside typical lower frequencyoutputs for normal use, including music, voice outputs, and so forth, atleast one example of a device can include a dual speaker system as shownin FIGS. 20A-21 . The speaker assemblies shown herein generally includetwo speakers sharing a front volume but having separate back volumesassociated with each speaker. Separate vents to the externalenvironment, in addition to the separate back volumes, can enable tuningof the speaker assembly to produce clear frequencies in various high andlow ranges from the various speakers in the device 1800 shown.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 16-19 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.16-19 .

FIG. 20A shows an example of an electronic device 1800 that includes anouter housing 1802 defining an internal volume 1852, a first speaker1863 and a second speaker 1861 disposed in the internal volume 1852, thefirst speaker 1863 including a frame 1859 disposed around a periphery ofa diaphragm 1857 of the first speaker 1863, a front volume 1855 definedby the outer housing, the first speaker 1863, and the second speaker1861, a first back volume 1853 defined by the first speaker 1863 and theframe 1859, and a second back volume 1845 defined by the second speaker1861 and the frame 1859.

In at least one example, the electronic device 1800 can include an outerhousing 1802, an inner housing 1851 spaced apart from the outer housing1802, a speaker assembly disposed between the inner and outer housings1802, 1851. The speaker assembly can include the first speaker 1863, thesecond speaker 1861, and the speaker frame 1859 supporting the firstspeaker 1863. The device can further include the first back volume 1853defined by the inner housing 1851 and the first speaker 1863 and thesecond back volume 1845 defined by the inner housing 1851 and the secondspeaker 1861, with the second back volume 1845 separated from the firstback volume 1853 by the speaker frame 1859.

Another example of the electronic device 1800 can include the outerhousing 1802, the inner housing 1851, the speaker assembly disposedbetween the inner and outer housings 1851, 1802 including the firstspeaker 1863 and the second speaker 1861. The device 1800 can alsoinclude a front volume 1855 defined by the outer housing 1802 and thespeaker assembly, the back volume defined by the inner housing and thespeaker assembly and separated into first and second isolated portions1853 and 1845, respectively. In at least one example, the device 1800can also include first vent 1849 defined by the housing 1802 throughwhich a first end of the front volume 1855 is in fluid communicationwith an external environment and a second vent 1847 defined by thehousing 1802 through which a second end of the front volume 1855 is influid communication with the external environment.

In at least one example, the front volume 1855 can be isolated from thefirst and second back volumes 1853 and 1845, respectively. The speakers1863, 1861 can be disposed between the front volume 1855 and the firstand second back volumes 1853, 1845 and the frame 1859 can structurallysupport the first speaker 1863. In at least one example, the frame 1859forms an air-tight seal between the first back volume 1853 and thesecond back volume 1845. In addition, as noted above, the inner housing1851 can at least partially define the first back volume 1853. Forexample, the frame 1859 can include a collar 1843 and a molded seal 1841extending from the collar 1843 toward the internal volume 1852 andcontacting the inner housing 1851 to seal the first back volume 1853 asshown behind/below the first speaker 1863. The collar 1843 can include ametal ring disposed around the speaker 1863 and configured to redirectmagnetic flux around the speaker 1863. In at least one example, thespeaker frame 1859 structurally supports the second speaker 1861.

In one example, the first speaker 1863 is smaller than the secondspeaker 1861. The first speaker 1863 can be referred to as a tweeter andbe configured to output higher frequency sound waves than the largersecond speaker 1861. Accordingly, to accommodate the smaller volumetricair displacement caused by the first speaker 1863, in at least oneexample, the first back volume 1853 can be smaller than the second backvolume 1845.

In at least on example, as shown in FIGS. 20A and 20B, the electronicdevice 1800 can also include a valve 1839 disposed in an aperturedefined by the inner housing 1851 to vent air from the first isolatedportion 1853 of the back volume to the internal volume 1852. In at leastone example, the pressure valve 1839 can be configured to equalizepressure between the internal volume 1852 and the back volume 1853. Inat least one example, the valve 1839 can include a mesh and a channelpassing through and defined by the inner housing 1851.

The shared front volume 1855 can be in fluid communication with anexternal environment through various vents passing through the outerhousing 1802. The location and configuration of each vent can bedesigned to accommodate high siren-type frequencies output by thesmaller tweeter speaker (first speaker 1863) and lower frequenciesoutput by the second speaker 1861. In this way, a broader range offrequencies can be output by the speaker assembly clearly andeffectively.

In at least one example, the first vent 1849 is formed of a singleaperture defined by the outer housing 1802. The second vent 1847 caninclude two or more apertures defined by the outer housing 1802. In atleast one example, a distance between any two adjacent apertures of thesecond vent 1847 can be less than a distance between any aperture of thesecond vent 1847 and the single aperture of the first vent 1849.

As noted above, the arrangement and configuration of the speakerassembly of the electronic device 1800 shown in FIGS. 20A and 20Benables the speaker assembly to output frequencies in the normal rangeof daily use, including music, voice, and other typical audio outputs,as well as loud, high frequencies in the range of above 3 kHz, 3.5 kHz,or even above 4.5 kHz from the first smaller speaker 1863 to be used asa siren. The siren can be used in conjunction with a fall-detectionsystem of the device 1800 to alert others if the user has fallen or beeninjured. During other activities, for example during mountain biking,the siren can output warning signals when coming around a blind corneron a trail or the like. A guardian mode of the device 1800 couldactivate the siren as an assault whistle or a mugging deterrent.

In order to fit the dual speaker assembly within a tight space betweenthe inner housing 1851 and the outer housing 1802 of the device 1800,some of the components discussed above and shown in FIGS. 20A-20B areconfigured to interface with and be disposed with other component of thedevice 1800 to form a tight, compact, space-saving device 1800. Forexample, the speaker assembly shown in FIGS. 20A and 20B can be disposedwithin the device 1800 in generally the same location as a button of thedevice, such that the button and the speaker assembly share the samelocation or portion of the internal volume of the device 1800. In suchan example, the button may include one or more components disposedbetween through, or with one or more components of the speaker assembly.

In order to accommodate the speaker assembly and the button together inthe same area, the speaker frame 1859, as shown in FIG. 20C, can includean opening 1835 defined by the frame 1859. The opening can be positionedto receive one or more components of a button that pass through theframe 1859. FIG. 20D illustrates the frame 1859 supporting the firstspeaker 1863 and the second speaker 1861 and defining the opening 1835.The opening 1835 can be defined/disposed between the first speaker 1863and the second speaker 1861. As shown in FIG. 20E, a button 1808 caninclude a plunger 1837 that is aligned with and/or extends through theopening 1835 between the first speaker 1863 and the second speaker 1861.

In at least one example of the electronic device 1800, the externalhousing 1802 can define an internal volume 1852 and an aperture 1833, aslabeled in FIG. 20B. The button 1808 can be disposed in the aperture1833. The button 1808 can include the plunger 1837 extending into ortoward the internal volume 1852 and the speaker frame 1859 can bedisposed in the internal volume 1852 and define the opening 1835. Insuch an example, the plunger can extend through the opening.

In one example, the frame 1859 can structurally support the firstspeaker 1863 and the second speaker 1861. The frame 1859 can be disposedin the internal volume 1852 with the frame 1859 defining the opening1835 (otherwise referred to herein as a “hole”) between the first andsecond speakers 1863, 1861, respectively. In at least one example, theplunger 1837 can be aligned with the hole/opening 1835. A portion of theinternal volume 1852 between the inner housing 1851 spaced part from theouter housing 1802 can define a speaker volume including the frontvolume 1855 and the first and second back volumes 1853, 1845,respectively. The plunger 1837 can be aligned with the hole 1835 andextend into the speaker volume toward the inner housing 1851.

In at least one example, the speaker frame 1859 supports the firstspeaker 1863 and the second speaker 1861 and the opening 1835 is definedbetween the first speaker 1863 and the second speaker 1861. Accordingly,in at least one example, the plunger 1837 extends between the firstspeaker 1863 and the second speaker 1861. In at least one example, theplunger 1837 can extend through the front volume 1855 and into the backvolume 1845.

In order to seal off the front volume 1855 from the second back volume1845, the device 1800 can include a gasket 1825 surrounding the plunger1837 and forming a fluid-tight seal between the frame 1859 and theplunger 1837. Thus a fluid-tight seal is formed by the gasket 1825between the front volume 1855 and the second back volume 1845. In atleast one example, the gasket can include an O-ring disposed around theplunger 1837. The plunger 1837 can define a recess in which the O-ringcan be disposed and positioned between the plunger 1837 and the speakerframe 1859. The materials, size, and shape of the O-ring 1825 can beselected to keep fluid out of the volumes surrounding the speakers 1863,1861 and to tune the tactile sensation experienced by the user whendepressing the button 1808.

In addition, as the button is pressed downward, the plunger can makecontact with an electrical contact 1823 disposed on the inner housing,as shown in at least FIG. 20F. The plunger is aligned with theelectrical contact 1823 so that an electrical pathway or circuit can becompleted between the plunger 1837 and the electrical contact 1823 whenthe button 1808 is pressed down during operation. Accordingly, theplunger can include or be formed from electrically conductive material.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 20A-20F can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.20A-20F.

FIG. 20G illustrates a side, cross-sectional view of a portion of thedevice 1800 showing a viewing plane orthogonal to the cross-sectionalviewing plane of FIG. 20F and extending through the plunger 1837. FIG.20G shows the button 1808 and the plunger 1837 extending through thehole 1835 defined by the speaker frame 1859 and the electrical contact1823 against which a lower surface of the plunger 1837 presses orcontacts when the button 1808 is depressed, as shown, to complete anelectrical circuit between the plunger 1837 and the electrical contact1823. When the button 1808 is not depressed, the plunger 1837 and theelectrical contact 1823 are separated so that no electrical connectionis made therebetween. The electrical contact 1823 can also be referredto herein as a “tactile switch” or a “tac switch.”

The tac switch 1823 can electrically couple and/or physically contact anelectrical flex 1804 partially disposed on a top surface of the innerhousing 1851 and at least partially extending under the tac switch 1823between the tac switch 1823 and the inner housing 1851. The flex 1804can extend around an edge of the inner housing 1851 and continueunderneath or on a lower surface, opposite the top surface of the innerhousing 1851, as shown. In one example, the bend formed in the flex 1804as the flex rounds the edge of the inner housing 1851 from one surfaceto the other can, on its own, bias the portion of the flex 1804 disposedbetween the tac switch 1823 and the inner housing 1851 away from theinner housing 1851.

In order to counteract this biasing force away from the inner housing1851, the device 1800 can include a foot 1806 pressing downward onto theflex 1804 to keep the flex 1804 in position between the tac switch 1823and the inner housing 1851, as shown in FIG. 20G. The foot 1806 can be amolded plastic piece or other non-conductive material anchored to thespeaker frame 1859, the inner housing 1851, or other component toproduce the force of the foot 1806 pressing the flex 1804 against theinner housing as shown. In at least one example, the foot 1806 can alsoengage the tac switch 1823 such that the foot 1806 presses the tacswitch against or toward the flex 1804 and/or the inner housing 1851.Additionally, or alternatively, one or more adhesives or adhesive layerscan be disposed between the flex 1804 and the inner housing 1851,between the tac switch 1823 and the flex 1804, and/or between the tacswitch 1823 and the inner housing 1851, to maintain the flex 1804 andtac switch 1823 in position as shown in FIG. 20G.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 20G can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG.20G.

FIG. 20H shows another example of a portion of a device 1800, includinga button 1808 and a button spring 1810. In at least one example, thebutton spring 1810 can include upwardly extending spring arms 1812 fixedto the button 1808. The button spring 1810, and specifically the springarms 1812, can be formed of conductive material, including metal, andshaped so as to provide an upward biasing force against the button 1808.The button spring 1810 can include a lower portion 1814 anchored to thespeaker housing 1859 or other component of the device 1800 relative towhich the button 1808 travels when depressed. In at least one example,the button spring 1810 provides a constant force to maintain anupper/outer surface of the button 1808 flush with an outer surface ofthe housing 1802 of the device 1800 (not shown in FIG. 20H but shown inat least FIGS. 20A and 20B). The materials, shapes, lengths of thespring arms 1814, and other factors of the button spring 1810 can betuned to alter the tactile response of the button 1808 when depressed bythe user.

Referring briefly to FIG. 20A, when the button 1808 is not depressed, anelectrical grounding path can be formed through one or more screws 1816contacting a portion of the housing 1802. Accordingly, the screws 1816and the housing 1802 can be formed of electrically conductive materials.The screws 1816 can act as a stop feature or datum contacting an innersurface of the housing 1802 to prevent the button 1808 from extendingbeyond the housing 1802 and maintaining a flush external surface withthe housing 1802. Referring again to FIG. 20H, when the button 1808 ispartially depressed, the screws 1816 separate from the housing 1802 butthe plunger 1837, which is also in electrical communication with thebutton 1808, is not yet in electrical contact with the tac switch 1823.

As shown in FIG. 20I, in this partially depressed position of the button1808, the button spring 1810 can form an electrical grounding pathwaybetween a grounding component or plane of the device 1800 and thebutton. The button spring 1810 can form such a grounding pathway withthe button 1808 whether the button 1808 is fully depressed to contactthe plunger against the tac switch 1823, partially depressed asdiscussed above, or when not depressed. The lower portion 1814 of thebutton spring 1810 can electrically contact or couple to a collar 1818,which can be coupled to ground, or one or more other components formingthe grounding pathway. The spring arms 1812 can contact the button 1808as shown in FIG. 20H to complete the pathway to the button 1808.

In at least one example, the lower portion 1814 of the button spring1810 defines an aperture 1820 through which the plunger 1837 extends. Inat least one example, the lower portion 1814 of the button spring 1810forms a bend 1822 that biases portions of the button spring 1810 oneither side of the bend 1822 away from each other, contributing to theupward force from the button spring 1810. For example, the bend 1822 canbias a first portion 1824 on one side of the bend 1822 away from asecond portion 1826 on the other side of the bend 1822.

In at least one example, the first portion 1824 contacts or extends intothe housing 1802 at 1828 to complete an electrical pathway from thebutton 1808, through the button spring 1810, to the housing 1802. Inaddition, in at least one example, a collar 1818 defines an aperture1830 and an anti-rotation feature or extension 1832 of the secondportion 1826 can extend through the aperture 1830 or at least partiallyinto the aperture 1830 to prevent the button spring 1810 from rotatingout of position as the button 1808 is depressed and travels up and downduring use. In at least one example, the anti-rotation feature 1832engages the collar 1818 without adhesives. In general, the button springcan be disposed and fixed in position as shown without adhesives. Thearea or volume in which the button spring 1810 is disposed can includean area between the inner housing 1851 and the outer housing 1802 suchthat any adhesives present could be exposed to chemical aggressors fromthe external environment, for example through the various vents definedby the housing, including first and second vents 1849 and 1847,respectively. Thus, the button spring 1810 can be fixed in position viathe anti-rotation feature 1832, an interface with the housing 1802 at1828, and/or with the button 1808.

In at least one example, the device 1800 can include a shim 1834disposed between the button 1808 or the button cap and the plunger 1837.In at least one example, the shim 1834 can include a material moreelastic or compressible than the button 1808 and/or the plunger 1837. Inone example, the button 1808 and the plunger 1837 include conductivemetals and the shim 1834 includes a plastic or rubber material. The shim1834 can be disposed between and in contact with the button 1808 and theplunger 1837 as shown such that the shim 1834 such that the shim 1834absorbs forces and movements from the plunger 1837 and the button 1808as the components of the speakers 1863, 1861 vibrate and pressure soundwaves impinge on the plunger 1837 and button 1808, the shim 1834 reduceschattering or buzzing caused by the plunger 1837 and button 1808vibrating against one another. In at least one example, the shim 1834can include an elastic material. In at least one example, the shim 1834can include a compressible material. In at least one example, thecompressible material can include foam.

Referring back to FIG. 20H, the device 1800 can include speaker meshes1836 a, 1836 b disposed over speakers 1863, 1861, respectively. Eachscrew 1816 of the button 1808 can include a lower surface 1838 of thescrew head facing the mesh 1836 a-b. The lower surface 1838 can bechamfered. The meshes 1836 a-b can be recessed to match or accommodatethe curvature of the lower surfaces 1838 of the screws 1816. Therecessed geometry of the meshes 1836 a-b can provide extra space orvolume into which the screws 1816 can extend toward the meshes 1836without the screws 1816 and meshes 1836 a-b contacting or colliding whenthe button 1808 is depressed. Additionally, the speaker meshes 1836 a,1836 b can include any number of stacked meshes of varying pore size andmaterial. Pore size can be identified and selected to balance theresistance to ingress of foreign materials, cosmetic benefits, waterejection, and acoustic performance. In some examples, the speaker meshescan both be metal and be welded to the device 1800. In other examples,the meshes can be metal, fabric, polymer, or a combination thereof, andcan be attached to the device 1800 by adhesives, fasteners, welding orother joining methods, and the like.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 20H-20I can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.20H-20I.

FIG. 20J shows a cross-sectional view of a portion of a device 1800,including a button 1808 disposed in an aperture 1833 defined by ahousing 1802 and a speaker diaphragm 1836 disposed in an internal volumeof the device 1800. The speaker diaphragm 1836, the button 1808, and thehousing 1802 can define the front volume 1855, which is also shown andlabeled in FIG. 20A. In at least one example, the device 1800 caninclude an acoustic gasket 1840 extending between the button 1808 andthe housing 1802. In at least one example, the gasket 1840 is greaterthan or equal to about 100 microns thick where the gasket 1840 contactsthe housing 1802. In at least one example, an upper surface of thegasket 1840 interfaces at an angle with the vertical surface of thehousing 1802 defining the aperture 1833 at greater than 0-degrees, forexample at least about 20-degrees or more relative to the horizontalplane orthogonal to the surface of the housing 1802 defining theaperture 1833. In at least one example, the gasket includes an elasticmaterial. In at least one example, the gasket 1840 includes a materialwith a Shore-A hardness of between about 30A and 90A, or between about40A and 80A, or between about 50A and 70A, for example about 60A.

Accordingly, with a gasket 1840 having the above-noted dimensions andmaterial properties, the gasket 1840 can maintain and rebound to itsresting shape after the button 1808 is depressed by the user. Inaddition, according to the above-noted dimensions and materialproperties, the gasket 1840 can seal the front volume 1855 such thatpressure can build up greater than an atmospheric pressure external tothe device 1800. In this way, the volume of the first speaker 1863 canbe increased. In at least one example, the material properties, shape,and dimensions of the gasket 1840 can be tuned to maximize at least oneof the resonant frequencies of the first speaker 1863. In at least oneexample, the gasket 1840 can be permeable to water but impermeable todust and debris from the external environment.

The first speaker 1863 can include two peak resonance frequencies, amechanical resonant frequency generated by shape of the first speaker1863 itself operating in open air and front port resonance leveragingthe length of the first vent 1849 as a tube that creates a higher pitchfrequency and lets sound out from the first speaker 1863 through thehousing 1802. The pressure built up in the front volume 1855, in partdue to the seal formed by the gasket 1840, affects the pressure waves ofsound from the first speaker 1863 exiting the first vent 1849. In thisway, the gasket 1840 can tune the sound from the first speaker 1863 andincrease the resonant tube frequency. In this way, multiple resonantfrequencies (mechanical and tube) can be utilized and a broader range ofsound frequencies can be increased.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 20J can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG.20J.

FIG. 20K illustrates a cross-sectional view of a portion of a device1800 including a button 1808, a housing 1802, and a gasket 1840extending between the housing 1802 and the button 1808. The button 1808can include an exterior color layer 1842 that can be formed by physicalvapor deposition. The color layer 1842 can also be referred to as a PVDlayer 1842. The PVD layer can extend over a first surface 1844 angled orcurved at a first angle or curvature and a second surface 1848 angled ata second angle different than the angle of the first surface 1844.During the PVD process of forming the PVD layer 1842, the PVD layer 1842can be deposited onto the button 1808 in a constant direction regardlessof the curvature, angles, or portion of the surface being deposited, inorder to simplify the PVD process. In one example, the direction ofdeposition is indicated by the deposition direction 1850.

Because the first angle of the first surface 1844 is different than thesecond angle of the second surface 1848, relative to the depositiondirection 1850, the PVD layer 1842 deposited on the first surface 1844is formed thicker than the PVD layer 1842 of the second surface 1848.This can be due to the steeper angle of the second surface 1848 relativeto the horizontal plane of FIG. 20K orthogonal to the depositiondirection 1850. As shown, the PVD layer 1842 of the second surface 1848is thinner than the PVD layer 1842 of the first surface 1844 due to thisdifference in angle relative to the deposition direction 1850. Thethickness of the PVD layer 1842 affects the color of the PVD layer 1842.In one example, the thicker PVD layer 1842 at the first surface 1844 canappear red while the color of the PVD layer 1842 at a transition orcorner surface 1846 between the first and second surfaces 1844, 1848 canappear blue and the color of the thinner PVD layer 1842 of the secondsurface 1848 can shift back toward red, for example appearing orange orred-orange. The thickness of the PVD layer 1842 at the corner 1846 canbe thicker than the PVD layer 1842 at the second surface 1848 butthinner than the PVD layer 1842 at the first surface 1844.

In the example noted above, the blue color of the PVD layer 1842 at thecorner 1846 stands out more visually compared to the red color of thePVD layer 1842 at the first surface 1844 than the orange color of thePVD layer 1842 at the second surface 1848. In order to minimize thecontrast of the blue and red between the corner 1846 and the firstsurface 1844, the corner 1846 can include a small radius of curvature tominimize the area of the surface of the button 1808 defined by thecorner 1846. While the PVD layer 1842 at the second surface 1848 isthinner than the PVD layer 1842 at the corner 1846, the orange color ofthe PVD layer 1842 at the second surface 1848 is closer to red andvisually less contrasting or noticeable. Thus, the angle of the secondsurface 1848 can be chosen to tune the thickness of the PVD layer 1842on the second surface 1848 relative to the thickness of the PVD layer1842 of the first surface 1842 in order to minimize the colordifference.

In at least one example, the second surface 1848 is angled between about1-degree and 10-degrees relative to the deposition direction 1850, orbetween about 3-degrees and about 7-degrees relative to the depositiondirection 1850, for example at about 5-degrees relative to thedeposition angle 1850. In this way, the thickness of the PVD layer 1842at the second surface 1848 can be less than about 50% of the thicknessor less than the thickness of the PVD layer 1842 of the first surface1844. In examples where the PVD layer 1842 at the second surface 1848 isless than about 50% of the thickness of the PVD layer 1842 at the firstsurface, the color difference between the PVD layer 1842 of the firstand second surfaces 1844, 1848 can be visually minimized.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 20K can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG.20K.

FIG. 21 illustrates a cross-sectional view of the assembly shown inFIGS. 20A-20F, with 1852 showing an internal volume of the device and1802 being the outer housing. During manufacturing, in order to simplifymachining of the housing 1802, an angled receiving cavity for thespeaker assembly can be machined into an inner surface of the housing1802 so that machining tools can reach needed points in the housing tomachine the cavity. Thus, in at least one example, the speaker assembly,including the speaker 1863 shown in FIG. 21 , can be disposed at anangle relative to the horizontal plane 1831 of the device 1800. In oneexample, the speaker angle η can be between about 5-degrees and10-degrees from the horizontal plane 1831 of the device 1800, forexample about 7.5-degrees, and the cavity angle β can be between about7-degrees and 13-degrees beyond the speaker angle Θ, for example about10-degrees.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 21 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG. 21.

As noted above, the wearable electronic devices described herein can beconfigured to be used during any daily activity of the user. Often, thewearable device will rub against other objects, including clothing, orbe subjected to wind if outside during use. Typically, these types ofinteractions, including rubbing, scratching, and wind blowing can causenegatively affect the performance of one or more microphones of thedevice. For example, some wearable devices can include a microphone toreceive the user's voice during a cellular call using the device.However, often when speaking in an outside environment where wind ispresent, the wind can cause unwanted noised as it passed over the deviceand specifically as it passed over one or more microphone apertures inthe housing of the device, which can create unwanted background noiseand unclear voice transmission from the device.

For example, as shown in FIG. 22 , a user is wearing a wearableelectronic watch 1900 on his/her wrist while riding a bicycle. Such anactivity causes wind to pass over and contact the device 1900. The samemay be true while walking, jogging, hiking, or any other active and/oroutdoor activity. FIG. 23 shows the device 1900 subject to wind flowingtoward and around the device 1900. Flow lines 1919 illustrate onepossible flow path of wind crossing over the device 1900. In someexamples, turbulent currents 1921 can be created at one or more sides ofthe device 1900. Such wind and turbulent flow can travel over certaincomponents or opening to microphones and speakers of the device 1900 andcause unwanted noise when transmitting the user's voice during acellular call or while recording his or her voice with the device 1900.

The extent of such noise interference from wind can vary depending onthe location of the microphone and the direction of the wind. As notedabove, the principles discussed with respect to wind interference canalso be true for other types of interference such as water and moistureinterference and rubbing or scratching the device 1900 against otherobjects such as clothes. FIG. 24 shows wind 1919 coming from variousdifferent directions all around the device 1900. The locations 1917 a,1917 b, 1917 c, and 1917 d on the device 1900 illustrate potentiallocations of a microphone of the device 1900. Again, the extent of noiseinterference from wind can vary depending on the location of themicrophone and the direction of the wind and those directions andlocations can vary from one moment to another during use.

In order to reduce the interference from wind and other objects,wearable electronic devices of the present systems and methods caninclude three microphones disposed in the internal volume of the deviceand configured to receive sound through three respective apertures, Thelocation and orientation of the apertures and microphones can be suchthat while one or two of the microphones may pick up wind interferenceduring use, at least one of the microphones and apertures will bepositioned and oriented to pick up less interference noise. In such aconfiguration, the device can be configured to process the combinednoise detected by all three microphones to reduce the noise. In oneexample, the device can be configured to rely more heavily onmicrophones picking up less interference noise such that the detectednoise is clear and un-affected by the interference noise caused by thewind.

In at least one example, as shown in FIG. 25 , a wearable electronicwatch 2000 can include a housing sidewall 2028 defining an internalvolume 2052 with the sidewall 2028 extending 360-degreescircumferentially around the internal volume 2052. The sidewall 2028 canalso define a first aperture 2015, a second aperture 2013 between about155-degrees and 205-degrees relative to the first aperture 2015, and athird aperture 2011 closer to the second aperture 2013 than the firstaperture 2015.

In addition, the device 2000 can include a first microphone 2009disposed in the internal volume 2052 and configured to receive soundthrough the first aperture 2015, a second microphone 2007 disposed inthe internal volume 2052 and configured to receive sound through thesecond aperture 2013, and a third microphone 2005 disposed in theinternal volume 2052 and configured to receive sound through the thirdaperture 2011.

In one example, the device 2000 can include a first strap receivingfeature 2001 and a second strap receiving feature 2003 opposite thefirst strap receiving feature 2001. A first sidewall portion 2004 canextend between the first strap receiving feature 2001 and the secondstrap receiving feature 2003 with the first sidewall portion 2004defining the first aperture 2015 closer to the first strap receivingfeature 2001 than the second strap receiving feature 2003. Further, oneexample can include a second sidewall portion 2006 disposed opposite thefirst sidewall portion 2004 and extending between the first strapreceiving feature 2001 and the second strap receiving feature 2003, thesecond sidewall portion 2006 defining a second aperture 2013 and a thirdaperture 2011, the second aperture 2013 defined closer to the secondstrap receiving feature 2003 than the first strap receiving feature2001. In such an example, as shown in FIG. 25 , the device 2000 caninclude a first microphone 2009 disposed in the internal volume 2052adjacent the first aperture 2015, a second microphone 2007 disposed inthe internal volume 2052 adjacent the second aperture 2013, and a thirdmicrophone 2005 disposed in the internal volume 2052 adjacent the thirdaperture 2011. While the present system is described as detecting noisesand wind from various side directions, the present system can alsoinclude microphones oriented to detect sounds and wind from variousorientations including into and out of the page illustrated in FIG. 24 .

In one example, as shown in FIG. 25 , the electronic device 2000 caninclude a fourth aperture 2008. The first microphone 2009 can bedisposed in the internal volume 2052 adjacent the first aperture 2015,the second microphone 2007 can be disposed in the internal volume 2052adjacent the second aperture 2013, and the third microphone 2005 can bedisposed in the internal volume 2052 adjacent the third aperture 2011.In addition, a speaker 2010 can be disposed in the internal volume 2052adjacent the fourth aperture 2008 such that a distance along thesidewall 2028 between the first and second apertures 2015, 2013 islarger than a distance along the sidewall 2028 between the second andthird apertures 2013, 2011 and the fourth aperture 2008 is adjacent thefirst aperture 2015.

In at least one example, the second aperture 2013 and the third aperture2011 can be defined on a distal side of the wearable electronic watch.The distal side of the wearable electronic watch 2000 can include or bedefined by the second sidewall portion 2006 where the term “distal”refers to anatomically distal when worn on the wrist of the user. Inother words, the distal side of the wearable electronic watch 2000includes the side facing the hand of the user when worn. Conversely, theproximal side of the wearable electronic watch 2000 can include or bedefined by the first sidewall portion 2004 where the term “proximal”refers to anatomically proximal when worn on the wrist of the user. Inother words, the proximal side of the wearable electronic watch 200includes the side facing the forearm of the user when worn. In at leastone example, the first aperture 2015 can be defined on the proximal sideof the wearable electronic watch 2000.

In at least one example, the second aperture 2013 cam be defined betweenabout 170 and 190 degrees relative to the first aperture 2015. In suchan example, the third aperture 2011 can be defined between about 30 and60 degrees counterclockwise along the sidewall 2028 relative to thesecond aperture 2013. In one example, the third aperture 2011 can bedefined between about 40 and 50 degrees counterclockwise along thesidewall 2028 relative to the second aperture 2013.

In at least one example of the wearable electronic watch 2000, thesidewall 2028 defines the strap receiving feature 2001 between the firstaperture 2015 and the second aperture 2013. The sidewall 2028 canfurther define the second strap receiving feature 2003 opposite thefirst strap receiving feature 2001 and between the third aperture 2011and the first aperture 2015. In at least one example, the first aperture2015 can be defined closer to the first strap receiving feature 2001than the second strap receiving feature 2003 and the second aperture2013 can be defined closer to the second strap receiving feature 2003than the first strap receiving feature 2001. In one example, the thirdaperture 2011 can be defined between the second aperture 2013 and thefirst strap receiving feature 2001.

In at least one example, the third aperture 2011 is defined betweenabout 30 and 60 degrees counterclockwise from the second aperture 2013along the housing sidewall 2028. The first aperture 2015 can be definedbetween about 170 and 190 degrees from the second aperture 2013 alongthe housing sidewall 2028. In at least one example, the first aperture2015 can be defined proximally relative to the first strap receivingfeature 2001 and the second strap receiving feature 2003 and the secondaperture 2013 and the third aperture 2011 can defined distally relativeto the first strap receiving feature 2001 and the second strap receivingfeature 2003.

In at least one example, the first microphone 2009 can be oriented toreceive sound from a first direction and the second microphone 2007 canbe oriented to receive sound from a second direction different than thefirst direction. In one example, the second direction is opposite thefirst direction. In such an example, the first aperture 2015 and thefourth aperture 2008 can be defined on a proximal side of the electronicdevice 2000. In such an example, the second and third apertures 2013,2011 can be defined on a distal side of the electronic device 2000.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 22-25 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.22-25 .

FIG. 26 illustrates another example of a wearable electronic device 2100including a sidewall 2128 defining an internal volume 2152 and first,second, and third apertures 2115, 2113, and 2111, respectively. A firstmicrophone 2109 is disposed in the internal volume 2152 adjacent thefirst aperture 2115 and configured to receive sound through the firstaperture 2115. A second microphone 2107 is disposed in the internalvolume 2152 adjacent the second aperture 2113 and configured to receivesound through the second aperture 2113. A third microphone 2105 isdisposed in the internal volume 2152 adjacent the third aperture 2111and configured to receive sound through the third aperture 2111. In theillustrated example of FIG. 26 , the apertures 2115, 2113, and 2111 aredefined by a distal sidewall portion 2106 between the first and secondstrap receiving features 2101 and 2103, respectively.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 26 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG. 26.

FIG. 27 shows another example of a wearable electronic device 2200including a sidewall 2228 defining an internal volume 2252 and first andsecond apertures 2215 and 2213, respectively. A first microphone 2209 isdisposed in the internal volume 2252 adjacent the first aperture 2215and configured to receive sound through the first aperture 2215. Asecond microphone 2207 is disposed in the internal volume 2252 adjacentthe second aperture 2213 and configured to receive sound through thesecond aperture 2213. In the illustrated example of FIG. 27 , theaperture 2215 is defined by a proximal sidewall portion 2204 between thefirst and second strap receiving features 2201 and 2203, respectively.The second aperture 2213 is defined by a distal sidewall portion 2206between the first and second strap receiving features 2201 and 2203,respectively.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 27 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG. 27.

FIG. 28 illustrates another example of a wearable electronic device 2300including a sidewall 2328 defining an internal volume 2352 and first andsecond apertures 2313 and 2311, respectively. A first microphone 2307 isdisposed in the internal volume 2352 adjacent the first aperture 2313and configured to receive sound through the first aperture 2313. Asecond microphone 2305 is disposed in the internal volume 2352 adjacentthe second aperture 2311 and configured to receive sound through thesecond aperture 2311. In the illustrated example of FIG. 28 , theapertures 2312 and 2111 are defined by a distal sidewall portion 2306between the first and second strap receiving features 2301 and 2303,respectively.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIG. 28 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIG. 28.

In each example shown in FIGS. 25-28 , the device can be configured toreceive and process multiple audio signals from the multiple microphonesthrough the multiple apertures and identify the microphone with thelowest perceived wind noise. This microphone can be used as the baselineand data can be extracted from the other locations to process a clearaudio signal. This can improve audio transmission and detectionperformance in windy conditions, when the device is rubbed againstanother object, or when one or more microphone apertures gets cloggedwith debris and/or liquid.

FIG. 29A shows a bottom elevation view of an example of a back cover1114 and an electromagnetically transparent component 1116 assembledtogether to form the back side or back surface of a device 1100. In atleast one example, the back cover 1114 can be secured to the sidewalls1128 of the device 1100.

In at least one example, the back cover 1114 can be secured to thesidewalls 1128 using one or more fasteners 1192. In the illustratedexample of FIG. 29A, four fasteners 1192 are used to secure the backcover 1114 to the sidewalls 1128, with one fastener 1192 disposed ateach corner of the device 1100. Using the fasteners shown, the backcover 1114, which in some examples can be made of ceramic, glass, orother brittle material, the back cover 1114 can be secured to thesidewalls 1128 without cracking, separating from the sidewalls 1128, orotherwise being damaged during assembly.

In at least one example, the back cover 1114 can include zirconia, orother brittle material, which is hard to CNC and machine to formintricate connection features. Using the fasteners shown in the figuresto secure the back cover 1114 to the sidewalls 1128 of the device 1100can simplify the geometry of the back cover 1114 in order to simplifythe manufacturing process thereof. For example, as shown in thecross-sectional view of FIG. 15B, the back cover 1114 can be formed of asimple geometry extending around the electromagnetically transparentcomponent 1116 and defining a through hole 1194 for each fastener 1192to pass through.

In at least one example, each fastener 1192 can be disposed through theback cover 1114 a certain distance away from an outer peripheral edge ofthe back cover 1114 such that enough material is present between thefastener 1192 and the outer peripheral edge of the back cover 1114 toprevent cracking of the back cover between the fastener and the outeredge. This distance is also designed to reduce any stress concentrationsin the back cover 1114 during and after assembly as the fastener 1192presses the material of the back cover 1114 against the sidewalls 1128.

As shown in FIGS. 30 and 31 , in at least one example, the through hole1194 defined by the back cover 1114 can include a counter bore in whichthe head 1196 of the fastener 1192 is disposed when assembled. Inaddition, in at least one example, the head 1196 of the fastener 1192can include an outwardly extend flange 1198 with a gasket 1199 pressedbetween the flange 1198 and the back cover 1114. In one example, thefastener 1192 can include a threaded screw. When assembled, the threadedscrew can be threaded into a threaded receiving hole defined by thesidewalls 1128 such that the head 1196 of the fastener 1192 presses theback cover 1114 against the sidewalls 1128.

The flange 1198 thus presses against the gasket 1199 forming anenvironmental seal against external moisture and other debris fromentering the through hole 1194. This environmental seal can also reducecorrosion of the fastener itself as it prevent water or othermoisture/fluid from entering the through hole 1194 and coming intocontact with the fastener 1192 disposed inside the through hole 1194.FIG. 31 shows an O-ring seal 1197 instead of the gasket shown in theexample of FIG. 30 , and FIG. 32 shows a side view of the fastener 1192with the gasket 1199 disposed underneath the flange 1198.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 29A-32 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.29A-32 .

In at least one example, as shown in FIG. 33A, the fastener 1292 caninclude an eave feature 1295 defined by the flange 1298 on a lower sideof the head 1296 configured to constrain an O-ring or gasket laterallyas the fastener 1292 pressed downward on the O-ring or gasket. FIG. 33Bshows an example of an O-ring 1297 disposed in the eave feature 1295.Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 33A and 33B canbe included, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.33A and 33B.

FIG. 34 illustrates a five-pointed punch 1393 indented into a topsurface of the head 1396 of a fastener 1392 with convex transition edgesbetween each of the five points of the punch shape. FIG. 35 illustratesa five-pointed punch 1493 indented into a top surface of the head 1496of a fastener 1492 with five concave points to form a five-leaf clovershape of the punch 1493. These punches 1393, 1493 can provideaesthetically pleasing punch designs and tool-specific mating featuresfor assembly and disassembly that increase surface area and engagementfor secure fastening and removal thereof.

Further, as shown in the top and side views of FIGS. 36A and 36B,respectively, the top surface of a fastener head 1596 can includepatterns and lines 1591 to further improve the aesthetic appeal, whileimproving surface engagement and secure removal, of the fastener 1592and other fasteners described herein and shown in other figures. In atleast one example, the lines 1591 can be scored, machines, etches, orotherwise physically formed into the surface of the head 1596. As shownfrom the side view of FIG. 36B, the lines or scoring features 1591 canbe formed to a certain depth into the head 1596 of the fastener 1592.

FIG. 37 illustrates a flow chart of a method 1600 of forming the scorelines and/or machined features 1591 shown in FIGS. 36A and 36B. In afirst step of the method 1600, a 50-degree feature is machined orotherwise formed into the surface at a depth of approximately 0.01 mm.Next, in step 1687 of the method 1600, the feature can be widened toapproximately 130-degrees at the same depth. Next, at step 1685, thefeature can be increased to a depth of approximately 0.05 mm to form anapproximately 45-degree feature. Then, at step 1683, the feature can bewidened to approximately 60-degrees at the same depth of approximately0.05 mm. Next, the depth of the feature can be increased toapproximately 0.10 mm to form an approximately 45-degree feature. Theangles and depth dimensions shown in FIG. 37 and described herein areexemplary only and can vary to form features of different sizes, shapes,number, and depth. In general, the depth and angle of the features canbe iteratively widened and deepened as described until the desired depthand angle of each feature is accomplished.

Any of the features, components, and/or parts, including thearrangements and configurations thereof shown in FIGS. 33A-37 can beincluded, either alone or in any combination, in any of the otherexamples of devices, features, components, and parts shown in the otherfigures. Likewise, any of the features, components, and/or parts,including the arrangements and configurations thereof shown in the otherfigures can be included, either alone or in any combination, in theexample of the devices, features, components, and parts shown in FIGS.33A-37 .

Wearable electronic devices currently on the market, including currentwearable electronic watches, cannot accurately detect environmentalpressures in both submerged environments and above water. Usually, thisis because the scale of pressures is so different between air pressureabove water and fluid pressure below water. It can be especiallydifficult to configure a single pressure sensor into such a device thatis sensitive enough to detect changes in air pressure above water butrobust enough to detect pressure changes under water, for example up to10-bar under water.

However, devices of the present disclosure, including the wearableelectronic devices and watches described herein, can include a singlepressure sensor to detect pressure above water and below water up to10-bar. In at least one example, the pressure sensor can be electricallyconnected to an ASIC switch and associated circuitry and processors toswitch pressure scales when high pressures are detected when the deviceis submerged under water.

For example, such an ASIC circuitry connected to the sensor can includea low gain mode that measures depth and a high gain mode that measuresdepth and elevation. This change in gain can be switched with the ASICto tune the sensor between water and air sensitivities. The processor ofthe device can also receive temperature measurement from a temperaturesensor of the device to take into account the temperature of theexternal environment, which can affect the pressure sensor reading andsensitivity. Along these lines, at least one example of such a devicecan also include a heater to apply heat to the pressure sensor in orderto perform a health check on the sensor to calibrate the sensor to itsoriginal calibration that was performed or set at the same temperatureto which it is heated by the heater.

To the extent applicable to the present technology, gathering and use ofdata available from various sources can be used to improve the deliveryto users of invitational content or any other content that may be ofinterest to them. The present disclosure contemplates that in someinstances, this gathered data may include personal information data thatuniquely identifies or can be used to contact or locate a specificperson. Such personal information data can include demographic data,location-based data, telephone numbers, email addresses, TWITTER® ID's,home addresses, data or records relating to a user's health or level offitness (e.g., vital signs measurements, medication information,exercise information), date of birth, or any other identifying orpersonal information.

The present disclosure recognizes that the use of such personalinformation data, in the present technology, can be used to the benefitof users. For example, the personal information data can be used todeliver targeted content that is of greater interest to the user.Accordingly, use of such personal information data enables users tocalculated control of the delivered content. Further, other uses forpersonal information data that benefit the user are also contemplated bythe present disclosure. For instance, health and fitness data may beused to provide insights into a user's general wellness, or may be usedas positive feedback to individuals using technology to pursue wellnessgoals.

The present disclosure contemplates that the entities responsible forthe collection, analysis, disclosure, transfer, storage, or other use ofsuch personal information data will comply with well-established privacypolicies and/or privacy practices. In particular, such entities shouldimplement and consistently use privacy policies and practices that aregenerally recognized as meeting or exceeding industry or governmentalrequirements for maintaining personal information data private andsecure. Such policies should be easily accessible by users, and shouldbe updated as the collection and/or use of data changes. Personalinformation from users should be collected for legitimate and reasonableuses of the entity and not shared or sold outside of those legitimateuses. Further, such collection/sharing should occur after receiving theinformed consent of the users. Additionally, such entities shouldconsider taking any needed steps for safeguarding and securing access tosuch personal information data and ensuring that others with access tothe personal information data adhere to their privacy policies andprocedures. Further, such entities can subject themselves to evaluationby third parties to certify their adherence to widely accepted privacypolicies and practices. In addition, policies and practices should beadapted for the particular types of personal information data beingcollected and/or accessed and adapted to applicable laws and standards,including jurisdiction-specific considerations. For instance, in the US,collection of or access to certain health data may be governed byfederal and/or state laws, such as the Health Insurance Portability andAccountability Act (HIPAA); whereas health data in other countries maybe subject to other regulations and policies and should be handledaccordingly. Hence different privacy practices should be maintained fordifferent personal data types in each country.

Despite the foregoing, the present disclosure also contemplatesembodiments in which users selectively block the use of, or access to,personal information data. That is, the present disclosure contemplatesthat hardware and/or software elements can be provided to prevent orblock access to such personal information data. For example, in the caseof advertisement delivery services, the present technology can beconfigured to allow users to select to “opt in” or “opt out” ofparticipation in the collection of personal information data duringregistration for services or anytime thereafter. In another example,users can select not to provide mood-associated data for targetedcontent delivery services. In yet another example, users can select tolimit the length of time mood-associated data is maintained or entirelyprohibit the development of a baseline mood profile. In addition toproviding “opt in” and “opt out” options, the present disclosurecontemplates providing notifications relating to the access or use ofpersonal information. For instance, a user may be notified upondownloading an app that their personal information data will be accessedand then reminded again just before personal information data isaccessed by the app.

Moreover, it is the intent of the present disclosure that personalinformation data should be managed and handled in a way to minimizerisks of unintentional or unauthorized access or use. Risk can beminimized by limiting the collection of data and deleting data once itis no longer needed. In addition, and when applicable, including incertain health related applications, data de-identification can be usedto protect a user's privacy. De-identification may be facilitated, whenappropriate, by removing specific identifiers (e.g., date of birth,etc.), controlling the amount or specificity of data stored (e.g.,collecting location data a city level rather than at an address level),controlling how data is stored (e.g., aggregating data across users),and/or other methods.

Therefore, although the present disclosure broadly covers use ofpersonal information data to implement one or more various disclosedembodiments, the present disclosure also contemplates that the variousembodiments can also be implemented without the need for accessing suchpersonal information data. That is, the various embodiments of thepresent technology are not rendered inoperable due to the lack of all ora portion of such personal information data. For example, content can beselected and delivered to users by inferring preferences based onnon-personal information data or a bare minimum amount of personalinformation, such as the content being requested by the deviceassociated with a user, other non-personal information available to thecontent delivery services, or publicly available information.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not target to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device, comprising: a housingsidewall defining an opening; a display component disposed in theopening and defining a gap between the housing and the displaycomponent; a cavity defined by the sidewall and the display component,the cavity in fluid communication with an external environment throughthe gap; and an epoxy at least partially defining the cavity and indirect contact with the housing sidewall.
 2. The electronic device of 1,wherein the epoxy is at least partially disposed between the displaycomponent and the housing.
 3. The electronic device of 2, furthercomprising one or more components stacked between the epoxy and thedisplay component.
 4. The electronic device of 3, wherein the one ormore components includes an antenna layer.
 5. The electronic device of3, wherein the one or more components comprises a polymer framesupporting a printed circuit board disposed in an internal volume. 6.The electronic device of 3, wherein the one or more components at leastpartially define the cavity.
 7. The electronic device of 1, wherein thehousing sidewall comprises: an upper portion; a lower portion; and amiddle portion disposed between the upper portion and the lower portion,the middle portion having a lower surface.
 8. The electronic device of7, wherein the epoxy is bonded to the lower surface of the middleportion.
 9. An electronic device, comprising: a housing sidewall havingan upper sidewall portion and a lower sidewall portion bonded to amiddle sidewall portion, the middle sidewall portion disposed betweenthe upper and lower sidewall portions, the housing defining an opening;a display disposed in the opening and defining a gap between the housingand the display; and an epoxy seal disposed between the display and thehousing, the epoxy extending laterally across the gap, and the epoxyseal bonded directly to the middle sidewall portion.
 10. The electronicdevice of 9, wherein the lower sidewall portion and the display definean internal volume.
 11. The electronic device of 10, wherein the epoxyseal defines at least a part of the internal volume.
 12. The electronicdevice of 11, wherein the middle sidewall portion is non-conductive. 13.The electronic device of 12, wherein the upper sidewall portion isconductive.
 14. The electronic device of 9, wherein the housingsidewall, the epoxy seal, and the display define a cavity in fluidcommunication with an external environment through the gap.
 15. Anelectronic device, comprising: a sidewall defining an internal volumeand an opening, the sidewall including: an upper portion; a lowerportion; and a middle portion disposed between and bonded to the upperportion and the lower portion; a display cover disposed in the openingand defining the internal volume; a side cavity defined by the displaycover and the sidewall, the cavity in fluid communication with anexternal environment through a gap formed between the display cover andthe sidewall; and an epoxy layer contacting the lower portion and themiddle portion and at least partially defining the cavity.
 16. Theelectronic device of 15, further including an insulating polymer layerand an antenna layer disposed between the epoxy layer and the displaycover, the polymer layer and the antenna layer defining the cavity. 17.The electronic device of 15, wherein the epoxy layer is bonded directlyto a lower surface of the middle portion.
 18. The electronic device of17, wherein the lower portion is bonded directly to the lower surface ofthe middle portion.
 19. The electronic device of 15, wherein the middleportion is non-conductive.
 20. The electronic device of 19, wherein theupper portion is conductive.